• Laser & Optoelectronics Progress
  • Vol. 59, Issue 9, 0922001 (2022)
Weijie Shi1、*, Zongqiang Yu1, Junhai Jiang1, Yongqiang Che2, and Sikun Li3
Author Affiliations
  • 1Dongfang Jingyuan Electronic Technology (Beijing) Co., Ltd., Beijing 100176China
  • 2Semiconductor Manufacturing North China (Beijing) Corporation, Beijing 100176, China
  • 3Laboratory of Information Optics and Opto‐Electronic Technology, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China
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    DOI: 10.3788/LOP202259.0922001 Cite this Article Set citation alerts
    Weijie Shi, Zongqiang Yu, Junhai Jiang, Yongqiang Che, Sikun Li. Computational Lithography Technology Under Chip Manufacture Context[J]. Laser & Optoelectronics Progress, 2022, 59(9): 0922001 Copy Citation Text show less
    Optical proximity effect[7]
    Fig. 1. Optical proximity effect[7]
    OPRX workflow[8]
    Fig. 2. OPRX workflow[8]
    OPC for line-end shorting and corner rounding[9]
    Fig. 3. OPC for line-end shorting and corner rounding[9]
    Source shapes of conventional illumination and off-axis illumination[10]
    Fig. 4. Source shapes of conventional illumination and off-axis illumination[10]
    Enhancement of isoline imaging with sub-resolution bars[11]
    Fig. 5. Enhancement of isoline imaging with sub-resolution bars[11]
    Schematic diagram of rule-based SBAR addition method for one-dimensional and two-dimensional graphics
    Fig. 6. Schematic diagram of rule-based SBAR addition method for one-dimensional and two-dimensional graphics
    Computational lithographic tools in modern IC manufacturing.
    Fig. 7. Computational lithographic tools in modern IC manufacturing.
    OPC scheme [17]
    Fig. 8. OPC scheme [17]
    Lithography simulation model[17]
    Fig. 9. Lithography simulation model[17]
    Scheme of model-based OPC
    Fig. 10. Scheme of model-based OPC
    Pinch and bridging defects[18]
    Fig. 11. Pinch and bridging defects[18]
    SMO workflow[22]
    Fig. 12. SMO workflow[22]
    Full-chip SMO workflow[24].
    Fig. 13. Full-chip SMO workflow[24].
    DPT process based on two graph splitting methods[25]. (a) Pattern to be split with a half period of 32 nm; (b) split graphics; (c) split patterns are placed on different masks respectively; (d) OPC for each mask; (e) photoresist pattern after exposure of each mask; (f) final photoresist pattern
    Fig. 14. DPT process based on two graph splitting methods[25]. (a) Pattern to be split with a half period of 32 nm; (b) split graphics; (c) split patterns are placed on different masks respectively; (d) OPC for each mask; (e) photoresist pattern after exposure of each mask; (f) final photoresist pattern
    Rule-based DPT coloring method[27]
    Fig. 15. Rule-based DPT coloring method[27]
    Application of ILT for mask optimization[29]. (a) Target layout graphics; (b) curve mask pattern; (c) simplified mask pattern
    Fig. 16. Application of ILT for mask optimization[29]. (a) Target layout graphics; (b) curve mask pattern; (c) simplified mask pattern
    Images and polygons hybrid-optimization ILT flow
    Fig. 17. Images and polygons hybrid-optimization ILT flow
    Speed-up of full-chip ILT optimization using deep learning[36]
    Fig. 18. Speed-up of full-chip ILT optimization using deep learning[36]
    Scheme of DTCO functions[38]
    Fig. 19. Scheme of DTCO functions[38]
    ASML holistic lithography[40]
    Fig. 20. ASML holistic lithography[40]
    From design to chip whole flow co-optimization
    Fig. 21. From design to chip whole flow co-optimization
    Resolution2 /nmWavelength /nmNAk1 reducing byOverlay1 /nm
    4003650.6OAI/OPC360
    2203650.65OAI/OPC15/30
    1802480.63OAI/OPC25/40
    1302480.7OAI/OPC25/40
    1102480.8OAI/OPC12/14
    901930.75OAI/OPC12/20
    65193i0.93OAI/Polarization/OPC3.5/5.0
    45193i41.2OAI/Polarization/OPC3.5/5.0
    38(28)193i1.35Freeform/Polarization/OPC2.5/5.5
    38(14)193i1.35Freeform/Polarization/OPC/MP2.5/4.5
    38(10)193i1.35Freeform/Polarization/OPC/MP2.0/3.5
    38(7)193i1.35Freeform/Polarization/OPC/MP1.6/2.5
    13(5)13.50.33Freeform/Polarization/OPC1.4/1.5
    Table 1. Resolution enhancement progress with Rayleigh criteria
    Weijie Shi, Zongqiang Yu, Junhai Jiang, Yongqiang Che, Sikun Li. Computational Lithography Technology Under Chip Manufacture Context[J]. Laser & Optoelectronics Progress, 2022, 59(9): 0922001
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