Author Affiliations
1State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China2Institute of Novel Semiconductors, Shandong University, Jinan 250100, China3Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China4Center of Materials Science and Optoelectronics Engineering and School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China5Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, Chinashow less
Fig. 1. (Color online) The schematic of the grown AlGaN/GaN HEMT structure.
Fig. 2. (Color online) The microscope photograph of the fabricated double-finger GaN HEMT with a LG of 0.45 µm and total WG of 200 µm. The pad is designed to be suitable for ground-signal-ground (GSG) probe.
Fig. 3. (Color online) The HRXRD results of the AlGaN/GaN HEMT structure with (a) ω-scan of (0002) and (b) (10-12) diffraction peaks, and (c) ω–2θ scan of (0004) planes.
Fig. 4. (Color online) The results of Non-contact Hall measurements at room temperature with average values of 2DEG (a) mobility and (b) concentration being 2291.1 cm2/(V·s) and 9.954 × 1012 cm–2, respectively.
Fig. 5. (Color online) Typical output characteristic (a) IDS–VDS and transfer characteristics (b) IDS–VGS. In PIV mode, each pulse cycle includes an on-state pulse of 300 µs with a duty cycle of 0.3%.
Fig. 6. (Color online) The extrinsic small signal characteristics of the fabricated AlGaN/GaN HEMT device.
Fig. 7. (Color online) The power performances of the fabricated AlGaN/GaN HEMT device. The measurement was performed under PW-mode with a pulse width of 100 μs and a duty cycle of 1%. The bias was in class-AB operation, under (a) (–3.5, 28) V, (b) (–3.5, 34) V and (c) (–3.5, 40) V gate/drain direct current (DC) bias, respectively.
Fig. 8. (Color online) The obtained Pout, PAE and power gain, depicted as a function of VDS. During the measurement, the Pin was fixed in 18 dBm, and the VGS was fixed in –3.5 V.
Fig. 9. (Color online) Pulsed current-voltage characteristics of the device. Measurements are taken under different quiescent bias point (VGSQ, VDSQ), as indicated in the graph. Each test pulse period consists of a 1 μs on-state pulse, followed by a 999 μs off-state pulse (0.1% duty cycle). Here VGS is taken from –6.0 to 2.0 V in steps of 1.0 V.
Order | Material | Purpose | Thickness
(nm)
| Temperature
(°C)
|
---|
1 | AlN | Nucleation layer | 50 | 1000–1050 | 2 | GaN | Buffer layer with high resistivity | 2000 | 1050 | 3 | GaN | High mobility channel layer | 100 | 1050 | 4 | AlN | Interlayer | 1 | 1000 | 5 | Al0.255Ga0.745N
| Barrier layer | 21.5 | 1000 | 6 | GaN | Cap layer | 3 | 1050 |
|
Table 1. The growth parameters of the AlGaN / GaN HEMT structure.
DC bias (VGS, VDS) (V)
| Pout (max) (dBm)
| Pin (dBm)
| G (dB)
| PAE (%) | G (compression) (dB)
| G (linear) (dB)
| Pout density (saturated) (W/mm)
|
---|
(–3.5, 28) | 30.54 | 19.54 | 11.00 | 50.56 | 6 | 17.04 | 5.66 | (–3.5, 34) | 30.61 | 18.52 | 12.09 | 46.67 | 6 | 18.22 | 5.75 | (–3.5, 40) | 30.94 | 19.00 | 11.94 | 39.56 | 6 | 18.19 | 6.21 |
|
Table 2. The detailed measurement results of power performances of the fabricated AlGaN/GaN HEMT device.
DC bias (VGS, VDS) (V)
| VDS − VK (V)
| PDC (W/mm)
| PRF (W/mm)
(VK = 4.2 V)
| ηD (%)
|
---|
(–3.5, 28) | 23.80 | 10.68 | 6.53 | 61.09 | (–3.5, 34) | 29.80 | 12.97 | 8.17 | 62.99 | (–3.5, 40) | 35.80 | 15.26 | 9.82 | 64.32 |
|
Table 3. The calculated possible output power and drain efficiency corresponding to different VDS from 28 to 40 V when VGS = –3.5 V.