Integrated circuit has been invented for more than 60 years, and the pursuit of more powerful performance chips makes the chip manufacturing technology constantly iterate and upgrade. For a long time, chip fabrication methods based on the ultraviolet lithographic projection system have been the only option for large-scale integrated chip fabrication. However, with the extremely ultraviolet lithography applied into the production line and optimized performance, chip manufacturing is advanced to the 7 nm and the following node. Academia and industry are not consensus of whether Moore’s law can last and extremely ultraviolet lithography can support the future chip demand. The next generation of lithography technology route is still undiscovered. Compared with the fifth generation lithography based on extreme ultraviolet projection exposure, this paper proposes the concept of the sixth generation lithographic system based on dual-beam super resolution technology, and discusses the advantages and potential of the sixth generation lithographic system based on dual-beam super resolution technology, and also discusses the difficulties and possible solutions. As an alternative technology different from the ultraviolet lithography technology, the dual-beam super resolution lithography will probably lead the future of chip manufacturing.