• Journal of Semiconductors
  • Vol. 40, Issue 1, 012803 (2019)
Yuanjie Lü, Xubo Song, Zezhao He, Yuangang Wang, Xin Tan, Shixiong Liang, Cui Wei, Xingye Zhou, and Zhihong Feng
Author Affiliations
  • National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China
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    DOI: 10.1088/1674-4926/40/1/012803 Cite this Article
    Yuanjie Lü, Xubo Song, Zezhao He, Yuangang Wang, Xin Tan, Shixiong Liang, Cui Wei, Xingye Zhou, Zhihong Feng. Source-field-plated Ga2O3 MOSFET with a breakdown voltage of 550 V[J]. Journal of Semiconductors, 2019, 40(1): 012803 Copy Citation Text show less
    References

    [1] H Z Zhang, L J Wang, C T Xia et al. Research progress of wide-gap semiconductor β-Ga2O3 single crystal. J Synth Cryst, 44, 2943(2015).

    [2] D Gogova, G Wagner, M Balndini et al. Structural properties of Si-doped β-Ga2O3 layers grown by MOVPE. J Cryst Growth, 401, 665(2014).

    [3] M Higashiwaki, K Sasali, T Kuramata et al. Depletion-mode Ga2O3 metal–oxide–semiconductor field-effect transistors on β-Ga2O3 (010) substrates and temperature dependence of their device characteristics. Appl Phys Lett, 103, 123511(2013).

    [4] M H Wong, K Sasaki, A Kuramata et al. Field-plated Ga2O3 MOSFET with a breakdown voltage of over 750V. IEEE Electron Device Lett, 37, 212(2016).

    [5] H Zhou, K Maize, G Qiu et al. β-Ga2O3 on insulator field-effect transistors with drain currents exceeding 1.5 A/mm and their self-heating effect. Appl Phys Lett, 111, 092102(2017).

    [6] T T Han, Y J Lv, P Liu et al. Research and fabrication of Ga2O3 MOSFET device with HfO2 gate dielectric. Semicond Technol, 43, 177(2018).

    [7] Y J Lv, J H Mo, X B Song et al. Influence of gate recess on the electronic characteristics of β-Ga2O3 MOSFETs. Superlattices Microstruct, 117, 132(2018).

    Yuanjie Lü, Xubo Song, Zezhao He, Yuangang Wang, Xin Tan, Shixiong Liang, Cui Wei, Xingye Zhou, Zhihong Feng. Source-field-plated Ga2O3 MOSFET with a breakdown voltage of 550 V[J]. Journal of Semiconductors, 2019, 40(1): 012803
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