[1] Yang C, Deng Y. The study of reforming pins for surface mount integrated circuit[J]. Electronics and Packaging, 14, 5-8, 32(2014).

[2] General administration of quality supervision, inspection, quarantine of the people's republic of China,(1993).

[3] Ministry of industry, information technology. Semiconductor integrated circuits—(2015).

[4] Wu F, Zhang X. Feature-extraction-based inspection algorithm for IC solder joints[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, 689-694(2011).

[5] Cai N, Lin J, Ye Q et al. A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, 161-172(2016).

[6] Chen S H, Perng D B. Automatic optical inspection system for IC molding surface[J]. Journal of Intelligent Manufacturing, 27, 915-926(2016).

[7] Wen X, Song K, Niu M et al. A three-dimensional inspection system for high temperature steel product surface sample height using stereo vision and blue encoded patterns[J]. Optik, 130, 131-148(2017).

[8] Song L M, Zhou X L, Xu K X et al. Three-dimensional defect detection based on single measurement image[J]. Acta Optica Sinica, 25, 1195-1200(2005).

[9] Li Y D, Gu P H. Free-form surface inspection techniques state of the art review[J]. Computer-Aided Design, 36, 1395-1417(2004).

[10] Sidki H M, Amer M. Evaluation of CMM for flatness measurements[J]. Metrology and Measurement Systems, 15, 585-593(2008).

[11] Zhou M B, Lin D J, Guo F R et al. Measurement of microstructure surface topography[J]. Optics and Precision Engineering, 7, 7-13(1999).

[12] YangL, GaoY, Wang XZ, et al., 2005, 295/296: 489- 494.

[13] Zhang Z Y, Lin Y. Building a 3D scanner system based on monocular vision[J]. Applied Optics, 51, 1638-1644(2012).

[14] Su X Y, Zhang Q C. Dynamic 3-D shape measurement method: a review[J]. Optics and Lasers in Engineering, 48, 191-204(2010).

[15] Guo M, Hu L L, Li J. Local point cloud reconstruction of ceramic-bowl-surface defect based on multi-image sequences[J]. Acta Optica Sinica, 37, 1215002(2017).

[16] Lange R, Seitz P. Solid-state time-of-flight range camera[J]. IEEE Journal of Quantum Electronics, 37, 390-397(2001).

[17] Tognola G, Parazzini M, Svelto C et al. A fast and reliable system for 3D surface acquisition and reconstruction[J]. Image and Vision Computing, 21, 295-305(2003).

[18] Pan W, Zhao Y, Ruan X Y. A new method for getting high precision phase in structural light measurement[J]. Acta Optica Sinica, 24, 687-691(2004).

[19] Bogue R. Three-dimensional measurements: a review of technologies and applications[J]. Sensor Review, 30, 102-106(2010).

[20] Li J J, Zhao H. Three-dimensional vision measuring technique based on multi-modal monogenic features detecting and matching[J]. Acta Optica Sinica, 31, 0712007(2011).

[21] Wang S, Xu X. 3D reconstruction based on horopter[J]. Acta Optica Sinica, 37, 0515004(2017).

[22] Lei Y Z, Zhao H J, Jiang H Z. A three-dimensional measurement method by combining binocular and monocular vision systems[J]. Acta Optica Sinica, 28, 1338-1342(2008).

[23] Wei Y J, Wu C D, Wang Y et al. Diffusion-based three-dimensional reconstruction of complex surface using monocular vision[J]. Optics Express, 23, 30364-30378(2015).

[24] Zeng Z P, Zhang J L, Wei Z S et al. Three-dimensional reconstruction method based on smartphone imaging[J]. Laser & Optoelectronics Progress, 55, 111502(2018).

[25] Lu S L, Zhang X M. Analysis and optimal design of illuminator for lead fess tin solder joint inspection[J]. Optics and Precision Engineering, 16, 1377-1383(2008).

[26] Bai X F, Zhang Z H. 3D shape measurement based on colour fringe projection techniques[J]. Chinese Journal of Scientific Instrument, 38, 1912-1925(2017).

[27] Wu F P, Guo J H, Zhang X M et al. 3D quality inspection method for PCB solder joint surface[J]. Chinese Journal of Scientific Instrument, 39, 233-240(2018).