Inspection of the coplanarity of pins in an integrated circuit (IC) is a very important process for ensuring the mounting quality of IC. In this paper, a coplanarity inspection method for IC pins based on a single image is proposed. First, a relation model that contains a camera, light source, and measured surface is constructed. This model is based on a monocular vision system. Then, the light intensity calibration method of a light emitting diode (LED) ring-structured light source is described, and the correlative parameter of the measured IC pin material is experimentally obtained. Further, a method for estimating the height information based on the constructed relationship model of light intensity and image grayscale is presented. Finally, the surface three-dimensional morphology of the IC pins and their solder joints are recovered using the height information. In comparison with the actual measurement results for IC pins and their solder joints, the experimental measurement results obtained in this work show that the measurement error for height is less than ±0.08 mm, and the relative error is within -2.6%, which verifies the effectiveness of the proposed method.