• Acta Optica Sinica
  • Vol. 40, Issue 1, 0111023 (2020)
Fupei Wu, Shukai Zhu, and Shengping Li*
Author Affiliations
  • Key Laboratory of Intelligent Manufacturing Technology, Ministry of Education, Shantou University, Shantou, Guangdong 515063, China
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    DOI: 10.3788/AOS202040.0111023 Cite this Article Set citation alerts
    Fupei Wu, Shukai Zhu, Shengping Li. Coplanarity Inspection Method for Integrated Circuit Pins Based on Single Image[J]. Acta Optica Sinica, 2020, 40(1): 0111023 Copy Citation Text show less
    Flow chart of monocular vision system
    Fig. 1. Flow chart of monocular vision system
    Diagram of monocular vision system
    Fig. 2. Diagram of monocular vision system
    Model of monocular vision system. (a) Illumination model; (b) simplified model
    Fig. 3. Model of monocular vision system. (a) Illumination model; (b) simplified model
    IC diagrams. (a) Original image; (b) red channel; (c) green channel; (d) blue channel
    Fig. 4. IC diagrams. (a) Original image; (b) red channel; (c) green channel; (d) blue channel
    Reconstruction result of IC. (a) Sideview of IC; (b) Y direction view of IC
    Fig. 5. Reconstruction result of IC. (a) Sideview of IC; (b) Y direction view of IC
    Cross-sections of IC. (a) Cross-section of IC solder joints; (b) cross-section of IC pins
    Fig. 6. Cross-sections of IC. (a) Cross-section of IC solder joints; (b) cross-section of IC pins
    Laser triangulation[17]
    Fig. 7. Laser triangulation[17]
    Reconstruction results of IC by using gray superposition method. (a) Sideview of IC; (b) Y direction view of IC
    Fig. 8. Reconstruction results of IC by using gray superposition method. (a) Sideview of IC; (b) Y direction view of IC
    Cross-sections of IC by using gray superposition method. (a) Cross-section of IC solder joints; (b) cross-section of IC pins
    Fig. 9. Cross-sections of IC by using gray superposition method. (a) Cross-section of IC solder joints; (b) cross-section of IC pins
    Probability distribution of IC reconstruction results
    Fig. 10. Probability distribution of IC reconstruction results
    Calibration pointCalibration positionfrfgfb
    Point 1(200, 384)18863431094
    Point 2(225, 384)1446275826
    Point 3(250, 384)1068131812
    Point 4(275, 384)676167397
    Point 5(300, 384)31610225
    Mean1079185671
    Table 1. Effect coefficient of material on light
    Sampling pointSolder joint of ICPin of IC
    Actual height (result in Ref. [17])Experimental heightErrorActual height (result in Ref. [17])Experimental heightError
    Point10.200.22-0.020.460.48-0.02
    Point20.280.230.050.500.480.02
    Point30.240.230.010.440.50-0.06
    Point40.220.23-0.010.420.50-0.08
    Point50.220.23-0.010.520.500.02
    Point60.240.230.010.520.490.03
    Point70.180.170.010.500.500
    Point80.200.23-0.030.480.480
    Point90.220.23-0.010.460.49-0.03
    Point100.220.23-0.010.500.480.02
    Table 2. 3D detection results of IC solder joints and pinsmm
    Sampling pointSolder joint of ICPins of IC
    Actual height (result in Ref. [17])Experimental heightErrorActual height (result in Ref. [17])Experimental heightError
    Point10.200.32-0.120.460.60-0.14
    Point20.280.32-0.040.500.60-0.10
    Point30.240.32-0.080.440.60-0.16
    Point40.220.32-0.100.420.60-0.18
    Point50.220.32-0.100.520.60-0.08
    Point60.240.32-0.080.520.60-0.08
    Point70.160.32-0.160.500.60-0.10
    Point80.200.32-0.120.480.60-0.12
    Point90.220.32-0.100.460.60-0.14
    Point100.220.32-0.100.500.60-0.10
    Table 3. 3D detection results of IC solder joints and pins based on gray superposition methodmm
    Fupei Wu, Shukai Zhu, Shengping Li. Coplanarity Inspection Method for Integrated Circuit Pins Based on Single Image[J]. Acta Optica Sinica, 2020, 40(1): 0111023
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