Author Affiliations
Key Laboratory of Intelligent Manufacturing Technology, Ministry of Education, Shantou University, Shantou, Guangdong 515063, Chinashow less
Fig. 1. Flow chart of monocular vision system
Fig. 2. Diagram of monocular vision system
Fig. 3. Model of monocular vision system. (a) Illumination model; (b) simplified model
Fig. 4. IC diagrams. (a) Original image; (b) red channel; (c) green channel; (d) blue channel
Fig. 5. Reconstruction result of IC. (a) Sideview of IC; (b) Y direction view of IC
Fig. 6. Cross-sections of IC. (a) Cross-section of IC solder joints; (b) cross-section of IC pins
Fig. 7. Laser triangulation
[17] Fig. 8. Reconstruction results of IC by using gray superposition method. (a) Sideview of IC; (b) Y direction view of IC
Fig. 9. Cross-sections of IC by using gray superposition method. (a) Cross-section of IC solder joints; (b) cross-section of IC pins
Fig. 10. Probability distribution of IC reconstruction results
Calibration point | Calibration position | fr | fg | fb |
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Point 1 | (200, 384) | 1886 | 343 | 1094 | Point 2 | (225, 384) | 1446 | 275 | 826 | Point 3 | (250, 384) | 1068 | 131 | 812 | Point 4 | (275, 384) | 676 | 167 | 397 | Point 5 | (300, 384) | 316 | 10 | 225 | Mean | | 1079 | 185 | 671 |
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Table 1. Effect coefficient of material on light
Sampling point | Solder joint of IC | Pin of IC | |
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Actual height (result in Ref. [17]) | | Experimental height | Error | Actual height (result in Ref. [17]) | Experimental height | Error |
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Point1 | 0.20 | 0.22 | -0.02 | 0.46 | 0.48 | -0.02 | Point2 | 0.28 | 0.23 | 0.05 | 0.50 | 0.48 | 0.02 | Point3 | 0.24 | 0.23 | 0.01 | 0.44 | 0.50 | -0.06 | Point4 | 0.22 | 0.23 | -0.01 | 0.42 | 0.50 | -0.08 | Point5 | 0.22 | 0.23 | -0.01 | 0.52 | 0.50 | 0.02 | Point6 | 0.24 | 0.23 | 0.01 | 0.52 | 0.49 | 0.03 | Point7 | 0.18 | 0.17 | 0.01 | 0.50 | 0.50 | 0 | Point8 | 0.20 | 0.23 | -0.03 | 0.48 | 0.48 | 0 | Point9 | 0.22 | 0.23 | -0.01 | 0.46 | 0.49 | -0.03 | Point10 | 0.22 | 0.23 | -0.01 | 0.50 | 0.48 | 0.02 |
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Table 2. 3D detection results of IC solder joints and pinsmm
Sampling point | Solder joint of IC | Pins of IC | |
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Actual height (result in Ref. [17]) | | Experimental height | Error | Actual height (result in Ref. [17]) | Experimental height | Error |
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Point1 | 0.20 | 0.32 | -0.12 | 0.46 | 0.60 | -0.14 | Point2 | 0.28 | 0.32 | -0.04 | 0.50 | 0.60 | -0.10 | Point3 | 0.24 | 0.32 | -0.08 | 0.44 | 0.60 | -0.16 | Point4 | 0.22 | 0.32 | -0.10 | 0.42 | 0.60 | -0.18 | Point5 | 0.22 | 0.32 | -0.10 | 0.52 | 0.60 | -0.08 | Point6 | 0.24 | 0.32 | -0.08 | 0.52 | 0.60 | -0.08 | Point7 | 0.16 | 0.32 | -0.16 | 0.50 | 0.60 | -0.10 | Point8 | 0.20 | 0.32 | -0.12 | 0.48 | 0.60 | -0.12 | Point9 | 0.22 | 0.32 | -0.10 | 0.46 | 0.60 | -0.14 | Point10 | 0.22 | 0.32 | -0.10 | 0.50 | 0.60 | -0.10 |
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Table 3. 3D detection results of IC solder joints and pins based on gray superposition methodmm