• Journal of Semiconductors
  • Vol. 42, Issue 8, 084101 (2021)
Side Song1, Guozhu Liu1、2, Hailiang Zhang1, Lichao Chao1, Jinghe Wei1, Wei Zhao1, Genshen Hong1, and Qi He1
Author Affiliations
  • 1The 58th Institution of Electronic Science and Technology Group Corporation of China, Wuxi 214035, China
  • 2School of Electronic Science and Engineering, Southeast University, Nanjing 210096, China
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    DOI: 10.1088/1674-4926/42/8/084101 Cite this Article
    Side Song, Guozhu Liu, Hailiang Zhang, Lichao Chao, Jinghe Wei, Wei Zhao, Genshen Hong, Qi He. Reliability evaluation on sense-switch p-channel flash[J]. Journal of Semiconductors, 2021, 42(8): 084101 Copy Citation Text show less
    (Color online) (a) The three-dimensional sense-switch p-channel flash diagram. (b) The basic working schematic.
    Fig. 1. (Color online) (a) The three-dimensional sense-switch p-channel flash diagram. (b) The basic working schematic.
    (Color online) (a) The threshold voltage and drive current as a function of the program and erase cycles. (b) Electron trapping in the tunnel oxide or spacer at the drain side when programmed.
    Fig. 2. (Color online) (a) The threshold voltage and drive current as a function of the program and erase cycles. (b) Electron trapping in the tunnel oxide or spacer at the drain side when programmed.
    (Color online) (a) Current–time curve during read stress at room temperature. (b) I–V characteristic before and after read stress. I–V characteristic before and after high temperature storage (c) without cycling and (d) with 500 program and erase cycles before DRB. (e) Degradation of drive current versus time in bake. (f) I–V characteristic of the erased state device under high temperature storage.
    Fig. 3. (Color online) (a) Current–time curve during read stress at room temperature. (b) I–V characteristic before and after read stress. I–V characteristic before and after high temperature storage (c) without cycling and (d) with 500 program and erase cycles before DRB. (e) Degradation of drive current versus time in bake. (f) I–V characteristic of the erased state device under high temperature storage.
    (Color online) (a) The output characteristics of the programmed switch. (b) The programmed and erased state of the switch under different temperatures. (c) The threshold voltage and drive current with different temperature cycling.
    Fig. 4. (Color online) (a) The output characteristics of the programmed switch. (b) The programmed and erased state of the switch under different temperatures. (c) The threshold voltage and drive current with different temperature cycling.
    Side Song, Guozhu Liu, Hailiang Zhang, Lichao Chao, Jinghe Wei, Wei Zhao, Genshen Hong, Qi He. Reliability evaluation on sense-switch p-channel flash[J]. Journal of Semiconductors, 2021, 42(8): 084101
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