• High Power Laser Science and Engineering
  • Vol. 9, Issue 3, 03000e42 (2021)
Shengzhen Yi1、2, Feng Zhang3, Qiushi Huang1、2, Lai Wei3, Yuqiu Gu3, and Zhanshan Wang1、2、*
Author Affiliations
  • 1MOE Key Laboratory of Advanced Micro-Structured Materials, Tongji University, Shanghai200092, China
  • 2School of Physics Science and Engineering, Tongji University, Shanghai200092, China
  • 3Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang621900, China
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    DOI: 10.1017/hpl.2021.30 Cite this Article Set citation alerts
    Shengzhen Yi, Feng Zhang, Qiushi Huang, Lai Wei, Yuqiu Gu, Zhanshan Wang. High-resolution X-ray flash radiography of Ti characteristic lines with multilayer Kirkpatrick–Baez microscope at the Shenguang-II Update laser facility[J]. High Power Laser Science and Engineering, 2021, 9(3): 03000e42 Copy Citation Text show less

    Abstract

    High-resolution X-ray flash radiography of Ti characteristic lines with a multilayer Kirkpatrick–Baez microscope was developed on the Shenguang-II (SG-II) Update laser facility. The microscope uses an optimized multilayer design of Co/C and W/C stacks to obtain a high reflection efficiency of the Ti characteristic lines while meeting the precise alignment requirement at the Cu Kα line. The alignment method based on dual simulated balls was proposed herein, which simultaneously realizes an accurate indication of the center field of view and the backlighter position. The optical design, multilayer coatings, and alignment method of the microscope and the experimental result of Ti flash radiography of the Au-coned CH shell target on the SG-II Update are described.
    $$\begin{align}\frac{1}{u}+\frac{1}{v}=\frac{1}{f}=\frac{2}{R\cdot \sin \kern0.24em \theta},\end{align}$$ ((1))

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    Shengzhen Yi, Feng Zhang, Qiushi Huang, Lai Wei, Yuqiu Gu, Zhanshan Wang. High-resolution X-ray flash radiography of Ti characteristic lines with multilayer Kirkpatrick–Baez microscope at the Shenguang-II Update laser facility[J]. High Power Laser Science and Engineering, 2021, 9(3): 03000e42
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