Xiuguo Chen, Cai Wang, Tianjuan Yang, Jiamin Liu, Chengfeng Luo, Shiyuan Liu. Inline Optical Measurement and Inspection for IC Manufacturing: State-of-the-Art, Challenges, and Perspectives[J]. Laser & Optoelectronics Progress, 2022, 59(9): 0922025
- Laser & Optoelectronics Progress
- Vol. 59, Issue 9, 0922025 (2022)
![Target gratings in the scribe lines of IC chips [4]](/richHtml/lop/2022/59/9/0922025/img_01.jpg)
Fig. 1. Target gratings in the scribe lines of IC chips [4]
![Overview of the principle of optical scatterometry [6]](/richHtml/lop/2022/59/9/0922025/img_02.jpg)
Fig. 2. Overview of the principle of optical scatterometry [6]
![Schematic of different scatterometric setups. (a) (b) Angular scatterometers; (c) (d) spectroscopic scatterometers [6]](/Images/icon/loading.gif){kind=icon}
Fig. 3. Schematic of different scatterometric setups. (a) (b) Angular scatterometers; (c) (d) spectroscopic scatterometers [6]
Fig. 4. Grating structure. (a) Diffraction of light incident on the rectangular grating structure;(b) hierarchical approximation of arbitrary planar grating structures [6]
Fig. 5. Parameter extraction process based on nonlinear regression and library search methods [45]
Fig. 6. Commonly used IBO marks [53-55]. (a) Frame-in-Frame; (b) Box-in-Box; (c) Bar-in-Bar; (d) advanced imaging metrology; (e) Blossom mark
Fig. 7. Typical overlay marks in eDBO technology (a) Top view; (b) cross-section view along the x-direction
Fig. 8. Angular scatterometer for measuring the intensity difference between the positive and negative first-order diffraction light [56]
Fig. 9. Schematic of the monochromatic phase-shifting interferometer [67]
Fig. 10. Schematic of laser scattering confocal microscope [70]
Fig. 11. Schematic of the Surfscan SP1 inspection system from KLA Corporation [74]
Fig. 12. Schematic of the common-path interferometric microscope [84]
Fig. 13. Schematic of the through-focus scanning microscope [87]
Fig. 14. Defect inspection based on mechanical work and force [88]
Fig. 15. Schematic of typical defect inspection based on bright field microscopy [90]
Fig. 16. Simulation method for sensitivity of defection inspection based on bright field microscopy [94]
Fig. 17. Schematic of mask defect inspection system with concurrent transmission and reflection image acquisition using 199 nm continuous wave laser [99]
Fig. 18. Schematic of the scanning lensless imaging microscope [110]
Fig. 19. IC device technology node development trend [112]
Fig. 20. Dielectric function of silicon as a function of (a) film thickness and (b) nanowire size [113]
Fig. 21. CD-SAXS. (a)Schematic of transmission SAXS; (b) schematic of grazing-incidence SAXS [113]
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Table 1. Characteristics of angular scatterometry and spectroscopic scatterometry [6]
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