• Journal of Semiconductors
  • Vol. 43, Issue 3, 032402 (2022)
Zhengwu Shu, Lei Jiang, Xingxing Hu, and Yue Xu
Author Affiliations
  • College of Electronic and Optical Engineering & College of Microelectronics, Nanjing University of Posts and Telecommunications, Nanjing 210023, China
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    DOI: 10.1088/1674-4926/43/3/032402 Cite this Article
    Zhengwu Shu, Lei Jiang, Xingxing Hu, Yue Xu. An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology[J]. Journal of Semiconductors, 2022, 43(3): 032402 Copy Citation Text show less
    Schematic diagram of the noise power spectral density of VHDs.
    Fig. 1. Schematic diagram of the noise power spectral density of VHDs.
    The block diagram of the proposed vertical Hall sensor.
    Fig. 2. The block diagram of the proposed vertical Hall sensor.
    Schematic of (a) the FSVHD consisting of four interconnected 3CVHEs and (b) the four operating modes in the four-phase spinning technique.
    Fig. 3. Schematic of (a) the FSVHD consisting of four interconnected 3CVHEs and (b) the four operating modes in the four-phase spinning technique.
    (Color online) TCAD simulation results for the FSVHD sensitivity. Sensitivity as a function of (a) Ln and (b) Ld.
    Fig. 4. (Color online) TCAD simulation results for the FSVHD sensitivity. Sensitivity as a function of (a) Ln and (b) Ld.
    Schematic diagram of (a) the switched vertical Hall device using four-phase spinning current operation and (b) the output Hall voltage and offset voltage corresponding to the four-phase sequence clocks.
    Fig. 5. Schematic diagram of (a) the switched vertical Hall device using four-phase spinning current operation and (b) the output Hall voltage and offset voltage corresponding to the four-phase sequence clocks.
    The schematic diagram of the bridge instrumentation amplifier.
    Fig. 6. The schematic diagram of the bridge instrumentation amplifier.
    The schematic diagram of the CDS demodulation circuit.
    Fig. 7. The schematic diagram of the CDS demodulation circuit.
    (Color online) Hall sensor microphotograph: whole chip including pads with an active area with the back-annotated layout of main circuital blocks.
    Fig. 8. (Color online) Hall sensor microphotograph: whole chip including pads with an active area with the back-annotated layout of main circuital blocks.
    (Color online) Experimental setup.
    Fig. 9. (Color online) Experimental setup.
    (Color online) Test Hall voltages as a function of in-plane magnetic field for two FSVHDs. The inset picture shows the voltage-related sensitivity of two FSVHDs.
    Fig. 10. (Color online) Test Hall voltages as a function of in-plane magnetic field for two FSVHDs. The inset picture shows the voltage-related sensitivity of two FSVHDs.
    (Color online) Tested results of the optimized FSVHD. (a) Offset as a function of bias voltage and (b) 1/f noise at the various bias voltages.
    Fig. 11. (Color online) Tested results of the optimized FSVHD. (a) Offset as a function of bias voltage and (b) 1/f noise at the various bias voltages.
    (Color online) Measured differential output voltages of the vertical Hall sensor as a function of a magnetic field.
    Fig. 12. (Color online) Measured differential output voltages of the vertical Hall sensor as a function of a magnetic field.
    ReferenceThis workRef. [2] Ref. [24] Ref. [25] Ref. [26]
    CMOS technology0.18 μm 0.35 μm 0.35 μm 0.18 μm 0.18 μm
    Sensor typeVHDHHDVHDHHDHHD
    Supply voltage (V)3.33.33.351.8
    System sensitivity1.22 V/T50 mA/T1.67 V/T11 V/T19.9 V/T
    Spinning frequency (kHz)1002010250
    Measurement range (mT)2004030010
    Chip area (mm2) 2.311.555.291.16
    Residual offset (μT) 605027050
    Linearity (%)99.999.998.3>99.8
    Bandwidth (kHz)305001.63010
    Static power (mW)4.5402.72500.12
    Table 1. Performance Summary and Comparison Table of This Work With The Reported Ones.
    Zhengwu Shu, Lei Jiang, Xingxing Hu, Yue Xu. An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology[J]. Journal of Semiconductors, 2022, 43(3): 032402
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