• Journal of Semiconductors
  • Vol. 42, Issue 9, 092802 (2021)
Changxi Chen1、2, Quan Wang1、3, Wei Li1, Qian Wang1, Chun Feng1、2, Lijuan Jiang1、2, Hongling Xiao1、2, and Xiaoliang Wang1、2
Author Affiliations
  • 1Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 2Center of Materials Science and Optoelectronics Engineering and School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China
  • 3State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China
  • show less
    DOI: 10.1088/1674-4926/42/9/092802 Cite this Article
    Changxi Chen, Quan Wang, Wei Li, Qian Wang, Chun Feng, Lijuan Jiang, Hongling Xiao, Xiaoliang Wang. Effect of the post-gate annealing on the gate reliability of AlGaN/GaN HEMTs[J]. Journal of Semiconductors, 2021, 42(9): 092802 Copy Citation Text show less
    References

    [1] S Wu, X H Ma, L Yang et al. A millimeter-wave AlGaN/GaN HEMT fabricated with transitional-recessed-gate technology for high-gain and high-linearity applications. IEEE Electron Device Lett, 40, 846(2019).

    [2] J S Moon, J Wong, B Grabar et al. 360 GHz fMAX graded-channel AlGaN/GaN HEMTs for mmW low-noise applications. IEEE Electron Device Lett, 41, 1173(2020).

    [3] P Murugapandiyan, S Ravimaran, J William et al. Design and analysis of 30 nm T-gate InAlN/GaN HEMT with AlGaN back-barrier for high power microwave applications. Superlattices Microstruct, 111, 1050(2017).

    [4] Y Q Chen, X Y Liao, C Zeng et al. Degradation mechanism of AlGaN/GaN HEMTs during high temperature operation stress. Semicond Sci Technol, 33, 015019(2018).

    [5] J A del Alamo, J Joh. GaN HEMT reliability. Microelectron Reliab, 49, 1200(2009).

    [6] Z Gao, F Rampazzo, M Meneghini et al. Degradation mechanism of 0.15 μm AlGaN/GaN HEMTs: Effects of hot electrons. Microelectron Reliab, 114, 113905(2020).

    [7] D Marcon, T Kauerauf, F Medjdoub et al. A comprehensive reliability investigation of the voltage-, temperature- and device geometry-dependence of the gate degradation on state-of-the-art GaN-on-Si HEMTs. 2010 International Electron Devices Meeting, 20.3.1(2010).

    [8] S Sudharsanan, S Karmalkar. Modeling of the reverse gate leakage in AlGaN/GaN high electron mobility transistors. J Appl Phys, 107, 064501(2010).

    [9] R Jos. Reverse Schottky gate current in AlGaN-GaN high-electron-mobility-transistors. J Appl Phys, 112, 094508(2012).

    [10] H Zhang, E J Miller, E T Yu. Analysis of leakage current mechanisms in Schottky contacts to GaN and Al0.25Ga0.75N∕GaN grown by molecular-beam epitaxy. J Appl Phys, 99, 023703(2006).

    [11] S Turuvekere, D S Rawal, A DasGupta et al. Evidence of Fowler–Nordheim tunneling in gate leakage current of AlGaN/ GaN HEMTs at room temperature. IEEE Trans Electron Devices, 61, 4291(2014).

    [12] J Kotani, M Tajima, S Kasai et al. Mechanism of surface conduction in the vicinity of Schottky gates on AlGaN∕GaN heterostructures. Appl Phys Lett, 91, 093501(2007).

    [13] S Zhang, X Y Liu, K Wei et al. Suppression of gate leakage current in ka-band AlGaN/GaN HEMT with 5-nm SiN gate dielectric grown by plasma-enhanced ALD. IEEE Trans Electron Devices, 68, 49(2021).

    [14] K Kim, T J Kim, H L Zhang et al. AlGaN/GaN Schottky-gate HEMTs with UV/O3-treated gate interface. IEEE Electron Device Lett, 41, 1488(2020).

    [15] L Liu, Y Y Xi, S Ahn et al. Characteristics of gate leakage current and breakdown voltage of AlGaN/GaN high electron mobility transistors after postprocess annealing. J Vac Sci Technol B, 32, 052201(2014).

    [16] H Kim, J Lee, D M Liu et al. Gate current leakage and breakdown mechanism in unpassivated AlGaN∕GaN high electron mobility transistors by post-gate annealing. Appl Phys Lett, 86, 143505(2005).

    [17] E V Sleptsov, A V Chernykh, S V Chernykh et al. Investigation of the thermal annealing effect on electrical properties of Ni/Au, Ni/Mo/Au and Mo/Au Schottky barriers on AlGaN/GaN heterostructures. J Phys: Conf Ser, 816, 012039(2017).

    [18] A K Visvkarma, R Laishram, S Kapoor et al. Improvement in DC and pulse characteristics of AlGaN/GaN HEMT by employing dual metal gate structure. Semicond Sci Technol, 34, 105013(2019).

    [19] D W Yan, H Lu, D S Cao et al. On the reverse gate leakage current of AlGaN/GaN high electron mobility transistors. Appl Phys Lett, 97, 153503(2010).

    [20] M L Hao, Q Wang, L J Jiang et al. Gate leakage and breakdown characteristics of AlGaN/GaN high-electron-mobility transistors with Fe delta-doped buffer. Nanosci Nanotechnol Lett, 10, 185(2018).

    [21] Z J Lin, H Kim, J Lee et al. Thermal stability of Schottky contacts on strained AlGaN/GaN heterostructures. Appl Phys Lett, 84, 1585(2004).

    [22] S Turuvekere, N Karumuri, A A Rahman et al. Gate leakage mechanisms In AlGaN/GaN and AlInN/GaN HEMTs: Comparison and modeling. IEEE Trans Electron Devices, 60, 3157(2013).

    [23] H Kim, M L Schuette, J Lee et al. Passivation of surface and interface states in AlGaN/GaN HEMT structures by annealing. J Electron Mater, 36, 1149(2007).

    [24] D Marcon, J Viaene, P Favia et al. Reliability of AlGaN/GaN HEMTs: Permanent leakage current increase and output current drop. Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 249(2013).

    [25] C Y Chang, E A Douglas, J Kim et al. Electric-field-driven degradation in off-state step-stressed AlGaN/GaN high-electron mobility transistors. IEEE Trans Device Mater Reliab, 11, 187(2011).

    [26] M Meneghini, A Stocco, M Bertin et al. Time-dependent degradation of AlGaN/GaN high electron mobility transistors under reverse bias. Appl Phys Lett, 100, 033505(2012).

    Changxi Chen, Quan Wang, Wei Li, Qian Wang, Chun Feng, Lijuan Jiang, Hongling Xiao, Xiaoliang Wang. Effect of the post-gate annealing on the gate reliability of AlGaN/GaN HEMTs[J]. Journal of Semiconductors, 2021, 42(9): 092802
    Download Citation