In this paper, we investigated the effect of post-gate annealing (PGA) on reverse gate leakage and the reverse bias reliability of Al_0.23Ga_0.77N/GaN high electron mobility transistors (HEMTs). We found that the Poole–Frenkel (PF) emission is dominant in the reverse gate leakage current at the low reverse bias region (V_th < V_G < 0 V) for the unannealed and annealed HEMTs. The emission barrier height of HEMT is increased from 0.139 to 0.256 eV after the PGA process, which results in a reduction of the reverse leakage current by more than one order. Besides, the reverse step stress was conducted to study the gate reliability of both HEMTs. After the stress, the unannealed HEMT shows a higher reverse leakage current due to the permanent damage of the Schottky gate. In contrast, the annealed HEMT shows a little change in reverse leakage current. This indicates that the PGA can reduce the reverse gate leakage and improve the gate reliability.