Researching | Microelectronics

Microelectronics

Editors-in-Chief

Xiaojun Fu

CN50-1090/TN

ISSN

1004-3365

Frequency

Bimonthly issues

Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package

Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell

Research on Bending Model of Cantilever Beam for MEMS Microwave Power Sensors

Effect of Floating Electrodes on the Characteristics of Shielded Gate Trench MOSFET

Investigation of the Effect of Conduction Mechanism on Electrothermal Characteristics in JLNT-FET and IMNT-FET

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