CHEN Rong, XIAO Ling, LU Ke1, LUO Chi, LIAO Xiyi, HU Yanbin, ZHANG Ying, CUI Wei. Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package[J]. Microelectronics, 2023, 53(5): 938
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