• Photonics Research
  • Vol. 4, Issue 3, 0126 (2016)
Timo Lipka*, Lennart Moldenhauer, J?rg Müller, and Hoc Khiem Trie
Author Affiliations
  • Institute of Microsystems Technology, Hamburg University of Technology, 21073 Hamburg, Germany
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    DOI: 10.1364/prj.4.000126 Cite this Article Set citation alerts
    Timo Lipka, Lennart Moldenhauer, J?rg Müller, Hoc Khiem Trie. Photonic integrated circuit components based on amorphous silicon-on-insulator technology[J]. Photonics Research, 2016, 4(3): 0126 Copy Citation Text show less

    Abstract

    We present integrated-optic building blocks and functional photonic devices based on amorphous siliconon-insulator technology. Efficient deep-etched fiber-to-chip grating couplers, low-loss single-mode photonic wire waveguides, and compact power splitters are presented. Based on the sub-μmphotonic wires, 2 × 2 Mach–Zehnder interferometers and add/drop microring resonators (MRRs) with low device footprints and high finesse up to 200 were realized and studied. Compact polarization rotators and splitters with ≥10 dB polarization extinction ratio were fabricated for the polarization management on-chip. The tuning and trimming capabilities of the material platform are demonstrated with efficient microheaters and a permanent device trimming method, which enabled the realization of energy-efficient photonic circuits. Wavelength multiplexers in the form of cascaded filter banks and 4 × 4 routers based on MRR switches are presented. Fabrication imperfections were analyzed and permanently corrected by an accurate laser-trimming method, thus enabling eight-channel multiplexers with record low metrics of sub-mW static power consumption and ≤1°C temperature overhead. The high quality of the functional devices, the high tuning efficiency, and the excellent trimming capabilities demonstrate the potential to realize low-cost, densely integrated, and ultralow-power 3D-stacked photonic circuits on top of CMOS microelectronics.
    Ql1=Qi1+Qc1.(1)

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    LTE1TE0=λ2(neff,eneff,o),(2)

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    Δλr=neffT·λrngr·ΔT,(3)

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    Timo Lipka, Lennart Moldenhauer, J?rg Müller, Hoc Khiem Trie. Photonic integrated circuit components based on amorphous silicon-on-insulator technology[J]. Photonics Research, 2016, 4(3): 0126
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