Author Affiliations
1State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100086, China2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, Chinashow less
Fig. 1. SAGCM laminated structure and internal electric-field distribution
Fig. 2. Parameter relationships. (a) Relationship between PDE and over-bias at different temperatures[15]; (b) relationship between DCR and PDE for devices with different thicknesses of multiplication layers and fixed PDE[16]
Fig. 3. Parameter relationships. (a) Relationship between DCR and over-bias for devices with different thicknesses of multiplication layers; (b) relationship between DCR and temperature for devices with different thicknesses of multiplication layers at 4 V over-bias[15]
Fig. 4. Device platform design and array image of InGaAsP/InP SPAD. (a) Schematic of epitaxial layer and mesa structure of InGaAsP/InP SPAD designed by MIT; (b) micrograph of individual pixel; (c) micrograph of 4×4 detector array[24]
Fig. 5. APD/CMOS prepared by MIT. (a) Micrograph of bridged 32×32 APD/CMOS array; (b) micrograph of individual pixel in APD/CMOS array at high magnification[26]
Fig. 6. Related parameters and cross-sectional schematic of GM-APD. (a) PDE and crosstalk as functions of over-bias of GM-APD; (b) cross-sectional schematic of InP GM-APD array combined with MLA[33]
Fig. 7. Schematic of focal plane array structure of InP GM-APD. (a) Structure of InGaAs(P)/InP GM-APD; (b) reverse welding GM-APD focal plane array
Fig. 8. 1×16 InGaAs/InP SPAD line array[38]
Fig. 9. Schematic of optical path between two pixels. (a) Without metal trenches; (b) with metal trenches[38]
Fig. 10. InGaAs/InP avalanche photodiode. (a) Schematic of structure; (b) photograph of 8×8 array[39]
Multiplication zone thickness /μm | Over bias /V | Operating temperature /K | PDE /% | DCR /(109 Hz·cm-2) |
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1.4 | 5 | 280 | 53 | 22 | 1.4 | 5 | 240 | 56 | 1.3 | 2.0 | 10 | 240 | >70 | 1.3 |
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Table 1. Performance parameters of mesa-type InGaAsP/InP SPAD under different conditions
Absorption zone material | Operating temperature /K | Detection wavelength /μm | PDE /% | DCR /kHz | Dead time /μs |
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InGaAsP | 298 | 1.06 | 50 | <20 | 1 | InGaAs | 240 | 1.55 | 45 | <20 | 6 |
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Table 2. Experimental results of array pixel published by Verghese et al.[31] in 2007
Array scale | 32×32[36] | 32×128[36] | 32×32[18] |
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Detectionwavelength /μm | 1.06 | 1.06 | 1.55 | Operatingtemperature /K | 253 | 248 | 248 | Average DCR /kHz | 14 | 3.7 | 17.9 | Average PDE /% | 39 | 34 | 19.7 | PDE error /% | 6 | 9 | - |
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Table 3. Parameters of focal plane array of InP GM-APD developed by PLI
Devicediameter | 16 μm | 25 μm | 40 μm |
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Maximum DCR /kHz | 8.8 | 99.1 | 97.5 | Minimum DCR /kHz | 0.7 | 1.8 | 4.7 | Mean DCR /kHz | 3.5 | 29.7 | 40.7 | Maximum after-pulsing probability | 2.85×10-4 | 9.76×10-4 | 5.26×10-4 | Minimum after-pulsing probability | 2.37×10-5 | 2.66×10-7 | 9.16×10-6 | Mean after-pulsing probability | 6.72×10-5 | 8.04×10-5 | 8.95×10-5 |
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Table 4. DCR and after-pulsing probability statistically distributed at different sizes when PDE is 20% and operating temperature is 233 K
Institution | SAGCM | Device diameter /μm | Operating temperature /K | Array size | DCR /kHz | PDE /% |
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MIT | Mesa | 20 | 240 | 32×32 | <20 | 45 | PLI | Planar | 25 | 248 | 128×32 | 3.7 | 34 | Chongqing | Planar | | 235 | 8×8 | 32.5 | 19.5 |
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Table 5. Comparison of research progresses of various institutions in field of InGaAs/InP SPAD array