• Laser & Optoelectronics Progress
  • Vol. 56, Issue 22, 220001 (2019)
Kaibao Liu1、2, Xiaohong Yang1、2、*, Tingting He1、2, and Hui Wang1、2
Author Affiliations
  • 1State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100086, China
  • 2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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    DOI: 10.3788/LOP56.220001 Cite this Article Set citation alerts
    Kaibao Liu, Xiaohong Yang, Tingting He, Hui Wang. Indium Phosphide-Based Near-Infrared Single Photon Avalanche Photodiode Detector Arrays[J]. Laser & Optoelectronics Progress, 2019, 56(22): 220001 Copy Citation Text show less
    SAGCM laminated structure and internal electric-field distribution
    Fig. 1. SAGCM laminated structure and internal electric-field distribution
    Parameter relationships. (a) Relationship between PDE and over-bias at different temperatures[15]; (b) relationship between DCR and PDE for devices with different thicknesses of multiplication layers and fixed PDE[16]
    Fig. 2. Parameter relationships. (a) Relationship between PDE and over-bias at different temperatures[15]; (b) relationship between DCR and PDE for devices with different thicknesses of multiplication layers and fixed PDE[16]
    Parameter relationships. (a) Relationship between DCR and over-bias for devices with different thicknesses of multiplication layers; (b) relationship between DCR and temperature for devices with different thicknesses of multiplication layers at 4 V over-bias[15]
    Fig. 3. Parameter relationships. (a) Relationship between DCR and over-bias for devices with different thicknesses of multiplication layers; (b) relationship between DCR and temperature for devices with different thicknesses of multiplication layers at 4 V over-bias[15]
    Device platform design and array image of InGaAsP/InP SPAD. (a) Schematic of epitaxial layer and mesa structure of InGaAsP/InP SPAD designed by MIT; (b) micrograph of individual pixel; (c) micrograph of 4×4 detector array[24]
    Fig. 4. Device platform design and array image of InGaAsP/InP SPAD. (a) Schematic of epitaxial layer and mesa structure of InGaAsP/InP SPAD designed by MIT; (b) micrograph of individual pixel; (c) micrograph of 4×4 detector array[24]
    APD/CMOS prepared by MIT. (a) Micrograph of bridged 32×32 APD/CMOS array; (b) micrograph of individual pixel in APD/CMOS array at high magnification[26]
    Fig. 5. APD/CMOS prepared by MIT. (a) Micrograph of bridged 32×32 APD/CMOS array; (b) micrograph of individual pixel in APD/CMOS array at high magnification[26]
    Related parameters and cross-sectional schematic of GM-APD. (a) PDE and crosstalk as functions of over-bias of GM-APD; (b) cross-sectional schematic of InP GM-APD array combined with MLA[33]
    Fig. 6. Related parameters and cross-sectional schematic of GM-APD. (a) PDE and crosstalk as functions of over-bias of GM-APD; (b) cross-sectional schematic of InP GM-APD array combined with MLA[33]
    Schematic of focal plane array structure of InP GM-APD. (a) Structure of InGaAs(P)/InP GM-APD; (b) reverse welding GM-APD focal plane array
    Fig. 7. Schematic of focal plane array structure of InP GM-APD. (a) Structure of InGaAs(P)/InP GM-APD; (b) reverse welding GM-APD focal plane array
    1×16 InGaAs/InP SPAD line array[38]
    Fig. 8. 1×16 InGaAs/InP SPAD line array[38]
    Schematic of optical path between two pixels. (a) Without metal trenches; (b) with metal trenches[38]
    Fig. 9. Schematic of optical path between two pixels. (a) Without metal trenches; (b) with metal trenches[38]
    InGaAs/InP avalanche photodiode. (a) Schematic of structure; (b) photograph of 8×8 array[39]
    Fig. 10. InGaAs/InP avalanche photodiode. (a) Schematic of structure; (b) photograph of 8×8 array[39]
    Multiplication zone thickness /μmOver bias /VOperating temperature /KPDE /%DCR /(109 Hz·cm-2)
    1.452805322
    1.45240561.3
    2.010240>701.3
    Table 1. Performance parameters of mesa-type InGaAsP/InP SPAD under different conditions
    Absorption zone materialOperating temperature /KDetection wavelength /μmPDE /%DCR /kHzDead time /μs
    InGaAsP2981.0650<201
    InGaAs2401.5545<206
    Table 2. Experimental results of array pixel published by Verghese et al.[31] in 2007
    Array scale32×32[36]32×128[36]32×32[18]
    Detectionwavelength /μm1.061.061.55
    Operatingtemperature /K253248248
    Average DCR /kHz143.717.9
    Average PDE /%393419.7
    PDE error /%69-
    Table 3. Parameters of focal plane array of InP GM-APD developed by PLI
    Devicediameter16 μm25 μm40 μm
    Maximum DCR /kHz8.899.197.5
    Minimum DCR /kHz0.71.84.7
    Mean DCR /kHz3.529.740.7
    Maximum after-pulsing probability2.85×10-49.76×10-45.26×10-4
    Minimum after-pulsing probability2.37×10-52.66×10-79.16×10-6
    Mean after-pulsing probability6.72×10-58.04×10-58.95×10-5
    Table 4. DCR and after-pulsing probability statistically distributed at different sizes when PDE is 20% and operating temperature is 233 K
    InstitutionSAGCMDevice diameter /μmOperating temperature /KArray sizeDCR /kHzPDE /%
    MITMesa2024032×32<2045
    PLIPlanar25248128×323.734
    ChongqingPlanar2358×832.519.5
    Table 5. Comparison of research progresses of various institutions in field of InGaAs/InP SPAD array
    Kaibao Liu, Xiaohong Yang, Tingting He, Hui Wang. Indium Phosphide-Based Near-Infrared Single Photon Avalanche Photodiode Detector Arrays[J]. Laser & Optoelectronics Progress, 2019, 56(22): 220001
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