Author Affiliations
1Key Laboratory of Microelectronic Devices & Integration Technology, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China2University of Chinese Academy of Sciences, Beijing 100049, China3School of Microelectronics, University of Science and Technology of China, Hefei 230026, Chinashow less
Fig. 1. (Color online) Transformation relationships among Ga2O3 in different crystalline phases and their hydrates[21].
Fig. 2. (Color online) Crystal structure of β-Ga2O3[32].
Fig. 3. (Color online) The development of β-Ga2O3 transistor in recent years.
Fig. 4. (Color online) Schematic cross-section of β-Ga2O3 (a) MESFET[12] and (b) MOSFET[11].
Fig. 5. (Color online) (a) Schematic cross-section, (b) the off-state drain/gate leakage and breakdown curves, (c) temperature-dependent transfer characteristics at Vds = 30 V, and (d) DC and pulsed output curves of the β-Ga2O3 FP-MOSFET[16].
Fig. 6. Top–down SEM image of the two-finger MOSFET on (100) β-Ga2O3[55].
Fig. 7. (Color online) (a) SEM false-colored cross-section view of recessed-gate MOSFETs and HR-TEM of (b) its sidewall and (c) bottom facets of the gate-recess contact, (d) its gate-source and drain-source breakdown curves of both source-drain distances[15].
Fig. 8. (Color online) (a) Schematic cross-section and SEM image, and (b) three-terminal off-state breakdown curves of vertical β-Ga2O3 Fin-MISFET[14].
Fig. 9. (Color online) (a) Cross section schematic, (b) focused ion beam (FIB) cross sectional image, and (c) extrinsic small signal RF gain performance of RF β-Ga2O3 MOSFET[59].
Fig. 10. (Color online) (a) Schematic and (b) density-dependent field effect mobility of Silicon delta-doped β-Ga2O3 MESFET.
Fig. 11. (Color online) Depletion/enhancement-mode β-Ga2O3 on insulator (GOOI) FETs[17].
Semiconductor material | Si | GaN | 4H-SiC | β-Ga2O3 |
---|
Bandgap Eg (eV)
| 1.1 | 3.4 | 3.3 | 4.7–4.9 | Electron mobility μ (cm2·V−1·s−1)
| 1400 | 1200 | 1000 | 300 | Breakdown electric field Eb (MV/cm)
| 0.3 | 3.3 | 2.5 | 8 | Baliga’s FOM (εμEb3)
| 1 | 870 | 340 | 3444 | Thermal conductivity λ (W·cm−1·K−1)
| 1.5 | 2.1 | 2.7 | 0.11 |
|
Table 1. Comparison of the physical properties of Si, GaN, SiC and β-Ga2O3 semiconductor[6].
Device type | Substrateorientation | Gate dielectrics | Vbr (V)
| Jmax (mA/mm)
| On/off ratio | gm (mS/mm)
| Reference |
---|
D-MESFET | (010) β-Ga2O3 | — | 250 | — | 104 | 1.4 | [12]
| D-MOSFET | (010) β-Ga2O3 | Al2O3 | 370 | 39 | 1010 | — | [11]
| E-Fin FET | (100) β-Ga2O3 | Al2O3 | 600 | - | 105 | — | [15]
| Two-finger D-MOSFET | (100) β-Ga2O3 | Al2O3 | 230 | 60 | 107 | 1.1 | [55]
| Field plate D-MOSFET | (010) β-Ga2O3 | Al2O3 | 750 | 78 | 109 | 3.4 | [16]
| Recessed-gate D-MOSFET | (100) β-Ga2O3 | Al2O3 | — | 150 | 106 | 21.2 | [59]
| E-MOSFET | (010) β-Ga2O3 | Al2O3 | — | 1.4 | 106 | 0.38 | [56]
| D-MOSFET | (010) β-Ga2O3 | HfO2 | 400 | 45 | 108 | — | [74]
| Vertical trench D-MOSFET | (001) β-Ga2O3 | HfO2 | — | — | 103 | — | [75]
| Vertical Fin D-MOSFET | (-201) β-Ga2O3 | Al2O3 | 185 | 1 kA/cm2 | 109 | — | [58]
| D-MOSFET | β-Ga2O3 | SiO2 | 382 | 40 | 108 | 1.23 | [76]
| Recessed-gate E-MOSFET | (010) β-Ga2O3 | SiO2 | 505 | 40 | 109 | 7 | [15]
| Vertical Fin E-MISFET | (001) β-Ga2O3 | Al2O3 | 1057 | 300–500 kA/cm2 | 108 | — | [14]
| Delta doped D-MOSFET | (010) β-Ga2O3 | — | 170 | 140 | 106 | 34 | [61]
|
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Table 2. Development of Ga2O3 FETs and the corresponding performances.