Stress in HgCdTe large infrared focal plane array detector analyzed with finite element analysis

Wei-Ting ZHANG; Xing CHEN; Zhen-Hua YE

doi:10.11972/j.issn.1001-9014.2021.03.005

[1] Ming LIU, Cong WANG, Li-Qing ZHOU. Development of small pixel HgCdTe infrared detectors. Chin. Phys. B, 28, 17-25(2019).

[2] A Rogalski. Recent progress in infrared detector technologies. Infrared Physics & Technology, 54, 136-154(2011).

[3] Yan-Jin LI, Li HE, Jian-Rong YANG et al. Study on thermal mismatch stress of HgCdTe infrared focal plane array. J. Infrared Millim. Waves, 27, 410-412(2008).

[4] Hai-Mei GONG, Ya-Ni ZHANG, San-Gen ZHU et al. Study of reliable packaging for IRFPA detector. J. Infrared Millim. Waves, 28, 85-89(2009).

[5] Kwak, Jae. Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition. Journal of Mechanical Science and Technology, 28, 4899-4906(2014).

[6] Jia-Kai LIU. Thermal stress analysis on multilayer structure of MEMS. Electronic Components and Materials, 34, 71-74(2015).

[7] Qing-Duan MENG, Yan-Qiu LV, Zheng-Xiong LU et al. Stress in InSb infrared focal plane array detector analyzed with ANSYS. J. Infrared Millim. Waves, 29, 431-434(2010).

[8] M S Jadin, S Taib. Recent progress in diagnosing the reliability of electrical equipment by using infrared thermography. Infrared Physics & Technology, 55, 236-245(2012).

[9] Xia CAI, Liu CHEN, Qun ZHANG et al. Thermal fatigue failure analysis of SnPb solder joint in flip-chip assemblies. Chinese Journal of semiconductors, 23, 661-666(2002).

[10] Jun LIAO. Research on stress analysis and modification of micro-electronics device(2013).

[11] Y.- S Lai, C.-H Chen, T.-C Chiu. Analysis of fatigue delamination growth in flip-chip package. Acta Mechanica, 225, 2761-2773(2014).