Wei-Ting ZHANG, Xing CHEN, Zhen-Hua YE. Stress in HgCdTe large infrared focal plane array detector analyzed with finite element analysis[J]. Journal of Infrared and Millimeter Waves, 2021, 40(3): 308
- Journal of Infrared and Millimeter Waves
- Vol. 40, Issue 3, 308 (2021)
Fig. 1. Three-dimensional structure diagram of the detector
Fig. 2. Detector profile with Kovar equilibrium layer
Fig. 3. Multi-layer material structure system
Fig. 4. Warpage deformation of multi-layer material system
Fig. 5. Finite element mesh of module
Fig. 6. Without Kovar equilibrium layer (a) thermal deformation in low temperature, (b) thermal stress (z-axis downward is positive direction)
Fig. 7. With Kovar equilibrium layer (a) thermal deformation in low temperature; (b) thermal stress (z-axis downward is positive direction)
Fig. 8. Material layers composition of detector chip
Fig. 9. Comparison between adding Kovar equilibrium layer and not adding Kovar equilibrium layer (a) epilayer thermal stress of HgCdTe detector, (b) low temperature deformation of the centerline of detector chip surface
Fig. 10. On the detector chip (a) the curve of maximum thermal stress changing with thickness of Kovar equilibrium layer; (b) the curve of the deformation changing with the thickness of Kovar equilibrium layer
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Table 1. Material dimension parameters
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Table 2. Material properties
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