Lili Zhang, Shufeng Sun, Xi Wang, Fengyun Zhang, Pingping Wang, Chengming Cao, Zibin Zhang. Research Progress of Laser Micro-Nano Connection Technology[J]. Laser & Optoelectronics Progress, 2022, 59(3): 0300003
- Laser & Optoelectronics Progress
- Vol. 59, Issue 3, 0300003 (2022)
![Different welding modes in laser micro welding[18]. (a) Heat conduction welding; (b) deep penetration welding](/richHtml/lop/2022/59/3/0300003/img_1.jpg)
Fig. 1. Different welding modes in laser micro welding[18]. (a) Heat conduction welding; (b) deep penetration welding
![Variation of penetration depth in laser micro welding with laser power and welding speed[19-20]](/richHtml/lop/2022/59/3/0300003/img_2.jpg)
Fig. 2. Variation of penetration depth in laser micro welding with laser power and welding speed[19-20]
![Influence of different processing environments on weld morphology under laser micro welding. (a) Morphology of weld under with and without shielding gas[27]; (b) weld morphology under different pressure[28]](/Images/icon/loading.gif){kind=icon}
Fig. 3. Influence of different processing environments on weld morphology under laser micro welding. (a) Morphology of weld under with and without shielding gas[27]; (b) weld morphology under different pressure[28]
Fig. 4. Weld morphology of different scanning methods under laser micro welding[32]. (a)‒(c) Circumcision scan; (d)‒(f) linear scan
Fig. 5. Weld morphology under different defocusing amount under laser micro welding[33]. (a) Weld morphology in positive defocusing state; (b) weld morphology in negative defocus state
Fig. 6. Welding morphology of laser micro-welded NiTi SMA[38]
Fig. 7. Microscopic images of laser micro-welded nanostructures[40-41]. (a) Laser micro welding of gold nanoparticles; (b) laser micro welding nano-tip
Fig. 9. Schematic of laser soldering technology[54]
Fig. 10. Influence of laser power and welding time on solder spread area under laser soldering[56]
Fig. 11. Influence of welding speed on welding strength under laser soldering[59]
Fig. 12. Laser soldering of QFP devices[65]. (a) Finite element simulation welding temperature field model; (b) welding effect diagram of laser soldering technology
Fig. 13. Microstructure morphology of solder joints under different processing methods[69]. (a) Infrared reflow welding; (b) diode-laser soldering
Fig. 14. Application of laser soldering in lead-free solder[76]
Fig. 15. Influence of different content of Zn in SnAgCu solder on soldering strength[82]
Fig. 16. Sectional view of cable connection device[85]. (a) Laser soldering cable device; (b) microstructure diagram of solder paste and metal connection
Fig. 17. Principle of laser soldering bumping technology[86]
Fig. 18. Changes of solder ball morphology under different parameters during laser soldering bumping[91]. (a) Pit defect; (b) offset defect; (c) ablation defect; (d) qualified appearance
Fig. 19. Two different scanning methods[95]. (a) Cross scan method; (b) linear scanning method
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Table 1. Joining categories based on size of connected materials[15]
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