Author Affiliations
1Institute of Laser and Intelligent Manufacturing, South-Central University for Nationalities, Wuhan , Hubei 430074, China2College of Electronic and Information Engineering, South-Central University for Nationalities, Wuhan , Hubei 430074, Chinashow less
Fig. 1. Picosecond laser processing experimental machine
Fig. 2. Effect of deflection of wedge prism 1 on diameter
Fig. 3. Three micro-hole models. (a) Negative conical; (b) cylindrical drilling; (c) positive conical
Fig. 4. Relationship between pulse energy and diameters of entrance and exit
Fig. 5. Ways of pulse laser processing. (a) Energy density distribution of Gaussian beam;(b) trajectory of laser spot scanning by helical drilling method
Fig. 6. Relationship between defocusing amount and diameters of entrance and exit
Fig. 7. Profile of micro-holes under different defocusing amounts
Fig. 8. Defocus forms. (a) f<0; (b) f=0; (c) f>0
Fig. 9. Effects of laser pulse. (a) Superposition of laser pulse intensity; (b) helical path of laser spot
Fig. 10. Relationship between repetition frequency and color rendering of entrance and exit
Fig. 11. Relationship between recast layer of entrance and laser helical speed
Fig. 12. Relationship between angle position of wedge prism 1 and diameters of entrance and exit
Fig. 13. Relationship between beam parallel shift of M2 and diameters of entrance and exit
Fig. 14. Profile of micro-holes under different beam parallel shifts of M2
Laser parameter | Value |
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Wavelength /nm | 1064 | Pulse duration /ps | 10 | Average power /W | 0~50 | Pulse energy /μJ | 0~200 | Repetitive rate /kHz | 10~1000 | Beam quality parameter M2 | ≤1.2 |
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Table 1. Basic performance parameters of laser
Processing parameter | Value |
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Wedge prism angle /(°) | -25~25 | Deflection mirror position /mm | -5~5 | Helical speed /(r⋅min-1) | 0~5000 | Defocus amount /mm | -0.5~0.5 | Process gas /MPa | 2.5 |
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Table 2. Processing parameters of helical drilling system