• Laser & Optoelectronics Progress
  • Vol. 59, Issue 7, 0714005 (2022)
Xiaodong Liu1、2, Liang Chen1、2, Xizhao Wang1、*, and Zhengjun Xiong1
Author Affiliations
  • 1Institute of Laser and Intelligent Manufacturing, South-Central University for Nationalities, Wuhan , Hubei 430074, China
  • 2College of Electronic and Information Engineering, South-Central University for Nationalities, Wuhan , Hubei 430074, China
  • show less
    DOI: 10.3788/LOP202259.0714005 Cite this Article Set citation alerts
    Xiaodong Liu, Liang Chen, Xizhao Wang, Zhengjun Xiong. Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling[J]. Laser & Optoelectronics Progress, 2022, 59(7): 0714005 Copy Citation Text show less

    Abstract

    In order to explore the high-quality forming process of micro-holes, the picosecond laser combined with helical drilling technology was used to carry out the basic experiments of micro-hole forming. The shape (taper and size) of the micro-hole can be controlled by changing the deflection angle and translation of the wedge prism in the optical path of the rotating optical system. Taking 1-mm 304 stainless steel as an example, the influence of processing parameters such as laser pulse energy, defocusing amount, repetition frequency and laser helical drilling speed on the quality of micro-hole processing was studied. According to the experimental results, laser pulse energy is the key factor of micro-hole forming quality, defocusing amount can change the taper of the micro-hole to a certain extent, and the repetition frequency and rotation speed of the laser determine the thermal influence of the micro-hole and the thickness of the recasting layer. While laser pulse energy is 141 µJ, repetition frequency is 66.67 kHz, defocusing amount is +0.1 mm, and laser helical drilling speed is 8000 r/min, the high-quality micro-holes with pore diameters ranging from 100 to 300 μm and controllable tapers can be obtained.
    Xiaodong Liu, Liang Chen, Xizhao Wang, Zhengjun Xiong. Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling[J]. Laser & Optoelectronics Progress, 2022, 59(7): 0714005
    Download Citation