Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling

Xiaodong Liu; Liang Chen; Xizhao Wang; Zhengjun Xiong

doi:10.3788/LOP202259.0714005

Journals >Laser & Optoelectronics Progress >Volume 59 >Issue 7 >Page 0714005 > Article

Laser & Optoelectronics Progress
Vol. 59, Issue 7, 0714005 (2022)

Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling

Xiaodong Liu^1、2, Liang Chen^1、2, Xizhao Wang^1、*, and Zhengjun Xiong¹

Author Affiliations

¹Institute of Laser and Intelligent Manufacturing, South-Central University for Nationalities, Wuhan , Hubei 430074, China

²College of Electronic and Information Engineering, South-Central University for Nationalities, Wuhan , Hubei 430074, China

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DOI: 10.3788/LOP202259.0714005 Cite this Article Set citation alerts

Xiaodong Liu, Liang Chen, Xizhao Wang, Zhengjun Xiong. Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling[J]. Laser & Optoelectronics Progress, 2022, 59(7): 0714005 Copy Citation Text

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Xiaodong Liu, Liang Chen, Xizhao Wang, Zhengjun Xiong. Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling[J]. Laser & Optoelectronics Progress, 2022, 59(7): 0714005

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