Fabrication and Planar Cooling Performance of Flexible Bi0.5Sb1.5Te3/epoxy Composite Thermoelectric Films

Peng LI; Xiao-Lei NIE; Ye TIAN; Wen-Bing FANG; Ping WEI; Wan-Ting ZHU; Zhi-Gang SUN; Qing-Jie ZHANG; Wen-Yu ZHAO

doi:10.15541/jim20180528

Journals >Journal of Inorganic Materials >Volume 34 >Issue 6 >Page 679 > Article

Journal of Inorganic Materials
Vol. 34, Issue 6, 679 (2019)

Fabrication and Planar Cooling Performance of Flexible Bi_0.5Sb_1.5Te₃/epoxy Composite Thermoelectric Films

Peng LI, Xiao-Lei NIE^*, Ye TIAN, Wen-Bing FANG, Ping WEI, Wan-Ting ZHU, Zhi-Gang SUN, Qing-Jie ZHANG, and Wen-Yu ZHAO^*

Author Affiliations

State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China

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DOI: 10.15541/jim20180528 Cite this Article

Peng LI, Xiao-Lei NIE, Ye TIAN, Wen-Bing FANG, Ping WEI, Wan-Ting ZHU, Zhi-Gang SUN, Qing-Jie ZHANG, Wen-Yu ZHAO. Fabrication and Planar Cooling Performance of Flexible Bi_0.5Sb_1.5Te₃/epoxy Composite Thermoelectric Films[J]. Journal of Inorganic Materials, 2019, 34(6): 679 Copy Citation Text

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XRD patterns of the composite films prepared with different contents of Bi0.5Sb1.5Te3 powder

. XRD patterns of the composite films prepared with different contents of Bi_0.5Sb_1.5Te₃ powder

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Cross-sectional FESEM images of the composite thick films prepared with different contents of Bi0.5Sb1.5Te3 powder

. Cross-sectional FESEM images of the composite thick films prepared with different contents of Bi_0.5Sb_1.5Te₃ powder

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. Temperature dependence of (a) electrical conductivity σ, (b) Seebeck coefficient α and (c) power factor α²σ of the composite thick films prepared with different content of Bi_0.5Sb_1.5Te₃powder

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. Anti-bending tests of flexible films: (a) bending radius and (b) bending cycles

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. Visual infrared images of the composite thick films measured with different currents (I)

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x	ρ/(g·cm^-3)	R_H/(×10^-1, cm³·C^-1)	n/(×10¹⁹, cm^-3)	μ_H/(cm²·V^-1·s^-1)	σ/(×10⁴, S·m^-1)
6.5	3.93	3.72	1.67	45.15	1.21
7	4.08	3.69	1.69	52.17	1.41
8	4.32	3.57	1.74	58.85	1.65
9	4.19	3.56	1.73	54.69	1.51
10	4.05	3.55	1.72	50.59	1.40

Table 1.

Densities and electrical properties of the composite films at room temperature

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Materials	Fabrication process	Annealing methods	σ/(×10⁴, S·m^-1)	α²σ/(mW·m^-1·K^-2)	Ref.
Bi_0.5Sb_1.5Te₃+epoxy	Screen printing	573 K, 4 h, hot pressing	1.67	1.12	This work
Bi_0.5Sb_1.5Te₃ ink	Inkjet printing	673 K, 30 min	0.20	0.07	[10]
Bi_0.5Sb_1.5Te₃+8%Te-epoxy	Dispenser printing	523 K	0.11	0.06	[14]
Bi_0.5Sb_1.5Te₃+C₂₄H₄₄O₆	Brush-printed	673 K, 4 h	0.29	0.15	[17]
Bi₂Te₃+1%Se-epoxy	Dispenser printing	623 K, 12 h	1.03	0.26	[20]
Bi_0.5Sb_1.5Te₃+epoxy	Brush-printed	623 K, 4 h, hot pressing	1.15	0.84	[22]
Bi_0.5Sb_1.5Te₃+8%Te-polymer	Dispenser printing	523 K	0.13	0.16	[25]