Interfacial Stress Analysis on Skutterudite-based Thermoelectric Joints under Service Conditions

Xiao SHAO; Rui-Heng LIU; Liang WANG; Jing CHU; Guang-Hui BAI; Sheng-Qiang BAI; Ming GU; Li-Na ZHANG; Wei MA; Li-Dong CHEN

doi:10.15541/jim20190112

[1] E BELL L. Cooling, heating, generating power and recovering waste heat with thermoelectric systems. Science, 321, 1457-1461(2008).

[2] D CHAMPIER. Thermoelectric generators: a review of applications. Energy Conversion and Management, 140, 167-181(2017).

[3] L CHEN, S BAI, Q ZHANG. Technologies and applications of thermoelectric devices: current status, challenges and prospects. Journal of Inorganic Materials, 34, 279(2019).

[4] C SALES B, D MANDRUS, K WILLIAMS R. Filled skutterudite antimonides: a new class of thermoelectric materials. Science, 272, 1325-1328(1996).

[5] H LIU, X SHI, F XU et al. Copper ion liquid-like thermoelectrics. Nature Materials, 11, 422-425(2012).

[6] D ZHAO L, H LO S, Y ZHANG et al. Ultralow thermal conductivity and high thermoelectric figure of merit in SnSe crystals. Nature, 508, 373-377(2014).

[7] H ZHANG Q, Y HUANG X, Q BAI S et al. Thermoelectric devices for power generation: recent progress and future challenges. Advanced Engineering Materials, 18, 194-213(2016).

[8] R HE, G SCHIERNING, K NIELSCH. Thermoelectric devices: a review of devices, architectures, and contact optimization. Advanced Materials Technologies, 3, 1700256(2018).

[9] Q ZHANG, J LIAO, Y TANG et al. Realizing a thermoelectric conversion efficiency of 12% in bismuth telluride/skutterudite segmented modules through full-parameter optimization and energy- loss minimized integration. Energy Environ. Sci., 10, 956-963(2017).

[10] Z YAO, P QIU, X LI et al. Investigation on quick fabrication of n-type filled skutterudites. Journal of Inorganic Materials, 31, 1375-1382(2016).

[11] V RAVI, S FIRDOSY, T CAILLAT et al. Mechanical properties of thermoelectric skutterudites. AIP Conference Proceedings, 969, 656-662(2008).

[12] R SALVADOR J, J YANG, X SHI et al. Transport and mechanical properties of Yb-filled skutterudites. Philosophical Magazine, 89, 1517-1534(2009).

[13] T DAHAL, S KIM H, S GAHLAWAT et al. Transport and mechanical properties of the double-filled p-type skutterudites La_0.68Ce_0.22Fe₄-xCo_xSb₁₂. Acta Materialia, 117, 13-22(2016).

[14] Z RUAN, L LIU, P ZHAI et al. Residual strength degradation of CoSb₃ skutterudite compounds under low-cycle fatigue loading. Journal of Electronic Materials, 41, 1487-1492(2012).

[15] P WEN, Y ZHU, J CHEN et al. The microstructure and thermoelectric properties of Yb-filled skutterudite Yb_0.1Co₄Sb₁₂ under cyclic thermal loading. Journal of Materials Engineering and Performance, 25, 4764-4768(2016).

[16] D ZHAO, X LI, L HE et al. Interfacial evolution behavior and reliability evaluation of CoSb₍₃₎/Ti/Mo-Cu thermoelectric joints during accelerated thermal aging. Journal of Alloys and Compounds, 477, 425-431(2009).

[17] L SHI, X HUANG, M GU et al. Interfacial structure and stability in Ni/SKD/Ti/Ni skutterudite thermoelements. Surface and Coatings Technology, 285, 312-317(2016).

[18] C FAN X, M GU, X SHI et al. Fabrication and reliability evaluation of Yb_0.3Co₄Sb₁₂/Mo-Ti/Mo-Cu/Ni thermoelectric joints. Ceramics International, 41, 7590-7595(2015).

[19] T WOJCIECHOWSKI K, R ZYBALA, R MANIA. High temperature CoSb₃-Cu junctions. Microelectronics Reliability, 51, 1198-1202(2011).

[20] M GU, X XIA, X LI et al. Microstructural evolution of the interfacial layer in the Ti-Al/Yb_0.6Co₄Sb₁₂ thermoelectric joints at high temperature. Journal of Alloys and Compounds, 610, 665-670(2014).

[21] S TANG Y, Q BAI S, D REN D et al. Interface structure and electrical property of Yb_0.3Co₄Sb₁₂/Mo-Cu element prepared by welding using Ag-Cu-Zn solder. Journal of Inorganic Materials, 30, 256-260(2015).

[22] M GU, S BAI, J WU et al. A high throughput strategy to screen interfacial diffusion barrier materials for thermoelectric modules. Journal of Materials Research, 34, 1179-1187(2019).

[23] L CHEN, S BAI, R LIU et al. Interface stability of skutterudite thermoelectric materials/Ti₈₈Al₁₂. Journal of Inorganic Materials, 33, 889-894(2018).

[24] S EL-GENK M, H SABER H, T CAILLAT et al. Tests results and performance comparisons of coated and un-coated skutterudite based segmented unicouples. Energy Conversion and Management, 47, 174-200(2006).

[25] H HSUEH C. Thermal stresses in elastic multilayer systems. Thin Solid Films, 418, 182-188(2002).

[26] M HAN, J HUANG, S CHEN. The influence of interface morphology on the stress distribution in double-ceramic-layer thermal barrier coatings. Ceramics International, 41, 4312-4325(2015).

[27] Y LI, Q YANG X, C ZHAI P et al. Thermal stress simulation and optimum design of CoSb₃/Bi₂Te₃ thermoelectric unicouples with graded interlayers. AIP Conference Proceedings, 973, 297-302(2008).

[28] X JIA, Y GAO. Estimation of thermoelectric and mechanical performances of segmented thermoelectric generators under optimal operating conditions. Applied Thermal Engineering, 73, 335-342(2014).

[29] M GU, X XIA, X HUANG et al. Study on the interfacial stability of p-type Ti/Ce_yFe_xCo₄-xSb₁₂ thermoelectric joints at high temperature. Journal of Alloys and Compounds, 671, 238-244(2016).