• Advanced Photonics
  • Vol. 5, Issue 3, 036004 (2023)
Jue Wang1、2、†, Chengkun Cai1、2, Feng Cui1、2, Min Yang1、2, Yize Liang1、2, and Jian Wang1、2、*
Author Affiliations
  • 1Huazhong University of Science and Technology, Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Wuhan, China
  • 2Optics Valley Laboratory, Wuhan, China
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    DOI: 10.1117/1.AP.5.3.036004 Cite this Article Set citation alerts
    Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang. Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects[J]. Advanced Photonics, 2023, 5(3): 036004 Copy Citation Text show less

    Abstract

    Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of light waves, which provides a degree of freedom to expand data transmission capacity. Various techniques based on bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, their inherent large size, extra loss, and precise alignment requirements make these techniques relatively difficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips with compact size and low loss provide a promising miniaturized candidate for tailoring light in the spatial dimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnects that are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonic chips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on the platform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing, and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnects using OAM modes are demonstrated in the experiment with favorable performance. This work paves the way to flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile optical interconnects and other emerging applications with spatial modes.
    Supplementary Materials
    Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang. Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects[J]. Advanced Photonics, 2023, 5(3): 036004
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