Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Jue Wang; Chengkun Cai; Feng Cui; Min Yang; Yize Liang; Jian Wang

doi:10.1117/1.AP.5.3.036004

Journals >Advanced Photonics >Volume 5 >Issue 3 >Page 036004 > Article

Advanced Photonics
Vol. 5, Issue 3, 036004 (2023)

Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Jue Wang^1、2、†, Chengkun Cai^1、2, Feng Cui^1、2, Min Yang^1、2, Yize Liang^1、2, and Jian Wang^1、2、*

Author Affiliations

¹Huazhong University of Science and Technology, Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Wuhan, China

²Optics Valley Laboratory, Wuhan, China

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DOI: 10.1117/1.AP.5.3.036004 Cite this Article Set citation alerts

Jue Wang, Chengkun Cai, Feng Cui, Min Yang, Yize Liang, Jian Wang. Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects[J]. Advanced Photonics, 2023, 5(3): 036004 Copy Citation Text

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