• Photonics Research
  • Vol. 9, Issue 11, 2205 (2021)
Qikai Huang1, Hui Yu1、2、*, Qiang Zhang1, Yan Li3, Weiwei Chen3, Yuehai Wang1, and Jianyi Yang1
Author Affiliations
  • 1Institute of Integrated Microelectronic Systems, College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
  • 2Zhejiang Lab, Hangzhou 310027, China
  • 3Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo 315211, China
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    DOI: 10.1364/PRJ.432731 Cite this Article Set citation alerts
    Qikai Huang, Hui Yu, Qiang Zhang, Yan Li, Weiwei Chen, Yuehai Wang, Jianyi Yang. Thermally enhanced responsivity in an all-silicon optical power monitor based on defect-mediated absorption[J]. Photonics Research, 2021, 9(11): 2205 Copy Citation Text show less

    Abstract

    We demonstrate a high responsivity all-silicon in-line optical power monitor by using the thermal effect to enhance the quantum efficiency of defect-mediated absorption at 1550 nm. The doping compensation technique is utilized to increase the density of lattice defects responsible for the sub-bandgap absorption and suppress the detrimental free carrier absorption. The 200-μm-long device presents a propagation loss as low as 2.9 dB/cm. Its responsivity is enhanced from 12.1 mA/W to 112 mA/W at -9 V bias by heating the optical absorption region. With this device, we build an optical power monitoring system that operates in the sampling mode. The minimal detectable optical power of the system is below -22.8 dBm, while the average power consumption is less than 1 mW at a sampling frequency of 10 Hz. Advantages of this scheme in terms of high responsivity, low insertion loss, and low power consumption lend itself to implement the feedback control of advanced large-scale silicon photonic integrated circuits.
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    Qikai Huang, Hui Yu, Qiang Zhang, Yan Li, Weiwei Chen, Yuehai Wang, Jianyi Yang. Thermally enhanced responsivity in an all-silicon optical power monitor based on defect-mediated absorption[J]. Photonics Research, 2021, 9(11): 2205
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