A method for simulating the intrinsic stress of thin films is proposed, and the thermal stress and the intrinsic stress of the multilayer films during the deposition process are numerically analyzed. By introducing the intrinsic stress coefficients and using the existing thermal stress finite element analysis program, the intrinsic stress of the films is simulated, and the correctness of this method is verified from a theoretical perspective. The growth of materials is simulated by using the model reconstruction and stress initialization method. The stress analysis model of multilayer films is established. The analysis results from the engineering examples indicate that the intrinsic stress and thermal stress of the multilayer films at each deposition stage can be conveniently simulated by using this method and procedure.