• Journal of Inorganic Materials
  • Vol. 34, Issue 8, 862 (2019)
Yi-Tian CHENG1、2, Wan-Qi QIU1、*, Ke-Song ZHOU1、2, Zhong-Wu LIU1, Dong-Ling JIAO1, Xi-Chun ZHONG1, and Hui ZHANG1
Author Affiliations
  • 1School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
  • 2The Key Lab of Guangdong for Modern Surface Engineering Technology, National Engineering Laboratory for Modern Materials Surface Engineering Technology, Guangdong Institute of New Materials, Guangzhou 510651, China
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    DOI: 10.15541/jim20180473 Cite this Article
    Yi-Tian CHENG, Wan-Qi QIU, Ke-Song ZHOU, Zhong-Wu LIU, Dong-Ling JIAO, Xi-Chun ZHONG, Hui ZHANG. Low-temperature Deposition of α-Al2O3 Films by Reactive Sputtering Al+α-Al2O3 Target[J]. Journal of Inorganic Materials, 2019, 34(8): 862 Copy Citation Text show less

    Abstract

    Low-temperature deposition of α-Al2O3 film is the key to expand its industrial applications. Al, α-Al2O3 and Al + 15wt% α-Al2O3 targets were used to deposit alumina films on Si(100). The as-deposited films by radio frequency magnetron sputtering (RFMS) were analyzed by grazing incidence X-ray diffraction (GIXRD), transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), and the nano-hardness was measured by depth-sensing indentation method. The results show that the single phase α-Al2O3 films were successfully deposited by reactive sputtering the Al+α-Al2O3 composite target at 550 ℃. When deposited at the substrate temperature of 550 ℃, the α-Al2O3 sputtered from the target preferentially form α-Al2O3 nucleus which could suppress the formation of γ phase, and promote the homoepitaxial growth of the α-Al2O3 to obtain the single phase α-Al2O3 films.
    Yi-Tian CHENG, Wan-Qi QIU, Ke-Song ZHOU, Zhong-Wu LIU, Dong-Ling JIAO, Xi-Chun ZHONG, Hui ZHANG. Low-temperature Deposition of α-Al2O3 Films by Reactive Sputtering Al+α-Al2O3 Target[J]. Journal of Inorganic Materials, 2019, 34(8): 862
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