We present a compact, highly tolerant vertical coupling structure, which can be a generic design that bridges the gap between conventional resonant couplers and adiabatic couplers for heterogeneously integrated devices. We show insights on relaxing the coupler alignment tolerance and provide a detailed design methodology. By the use of a multisegmented inverse taper structure, our design allows a certain proportion of the odd supermode to be excited during the coupling process, which simultaneously facilitates high tolerance and compactness. With a total length of 87 μm, our coupler is almost threefold shorter than the state-of-the-art alignment-tolerant adiabatic couplers and outperforms them by demonstrating a more than 94% coupling efficiency (for <0.3dB coupling loss) with ±1μm misalignment tolerance, which, to our best knowledge, is a new record for III-V-on-silicon vertical couplers. Furthermore, our design has high tolerance to fabrication-induced structural deformation and ultrabroad bandwidth. These features make it particularly suitable for building densely integrated III-V-on-silicon photonic circuits with commercially available microtransfer printing assembly tools. The proposed design can be widely adopted in various integration platforms.