Author Affiliations
1Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China2State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China3Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China4Institute of Solid State Physics and Center of Nanophotonics, Technische Universität Berlin, Hardenbergstrasse 36, 10623 Berlin, Germany5Bimberg Chinese-German Center for Green Photonics of the Chinese Academy of Sciences at CIOMP, Changchun 130033, Chinashow less
Fig. 1. Schematic of a top-emitting VCSEL [
19]. Inset is a scanning electron microscope image of the cross section of a high-speed VCSEL after it is cleaved.
Fig. 2. Small-signal model of a VCSEL with the high-frequency driving source.
Fig. 3. Schematic of representative optical modes (straight lines) and gain spectra (curves) behavior in a VCSEL as functions of increasing temperature. T0 denotes the typical room temperature.
Fig. 4. Simulated PAM4 and on–off keying (OOK) eye diagrams at 40 Gbps with a constant modulation bandwidth of 20 GHz.
Fig. 5. (a) End-to-end coupling between a VCSEL and a PIC based on an SOI platform [
115]. A spot-size convertor in the PIC side is always adopted for a high coupling efficiency between the VCSEL and the silicon waveguide. (b) VCSEL coupled to a PIC by 45° micro-reflectors [
116]. (c) Grating coupler for coupling between a VCSEL and a PIC [
123]. (d) Photonic wire bond for integration for a surface-emitting laser and a PIC [
127]. The laser can be a VCSEL or a distributed-feedback surface-emitting laser. PWB, photonic wire bond.
Fig. 6. Schematic of a tracking system based on SMI [
129,
130].
Fig. 7. Components of a face recognition module in a modern smartphone. (a) VCSELs for time-of-flight (ToF) proximity sensing and IR illumination. (b) VCSEL array for projection of randomly distributed dots to sense object distance information.
Fig. 8. (a) Schematic of focal plane scanning [
148,
151]. (b) Illustration of structured light [
153].
Fig. 9. (a) Schematic of an HCG. The red arrows show the direction of wave incidence. The black arrows indicate the E-field direction in both TE and TM polarizations of incidence. (b) Double-mode solution exhibiting perfect intensity cancellation at the HCG output plane leading to 100% reflectivity [
159].
Fig. 10. (a) Schematic of an HCG-VCSEL [
160]. (b) HCG-VCSEL array for single-lobe, double-lobe, triple-lobe, “bow-tie,” “sugar cone,” and “doughnut” beam patterns [
177]. (c) Schematic of a nanoelectromechanical tunable VCSEL using the highly reflective HCG as its top mirror, instead of conventional DBRs [
180]. (d) Schematic of a monolithic HCG-VCSEL array with different HCG parameters.
Fig. 11. (a) Schematic of a VCSEL with a silicon HCG as a bottom mirror. An HCG serves as the bottom mirror and potentially serves as a waveguide coupler for an in-plane SOI waveguide, facilitating the integration of a VCSEL with in-plane silicon photonic circuits [
188]. (b) Schematic of a vertical-cavity laser with lateral emission into a silicon waveguide via an HCG [
189]. (c) Schematic of a vertical-cavity laser with in-plane out-coupling into a SiN waveguide. A subwavelength grating is inserted under a half-VCSEL to redirect the vertical resonance light to the in-plane SiN waveguide [
192].
Group | (nm) | Bandwidth (GHz) | Bit Rate (Gbps) | Temperature (°C) | Oxide Aperture (μm) | Year | Refs. | IBM | 850 | 15.4 | 20 | 25 | 8 | 2001 | [54] | Finisar-IBM | 850 | 19 | 30 | 25 | 6 | 2008 | [55] | CUT | 850 | 20 | 32 | 25 | 9 | 2009 | [56] | CUT | 850 | 23 | 40 | 25 | 7 | 2010 | [57] | CUT | 850 | 28 | 44 | 25 | 7 | 2012 | [58] | CUT | 850 | 24 | 57 | 25 | 8 | 2013 | [59] | CUT | 850 | 30 | 50 | 25 | 3.5 | 2015 | [60] | TU Berlin | 850 | 20 | 30 | 25 | 6 | 2009 | [61] | TU Berlin | 850 | | 40 | 25 | 9 | 2009 | [62] | UIUC | 850 | 21.2 | 40 | 20 | 4 | 2014 | [63] | UIUC | 850 | 29.2 | 57 | 25 | 5 | 2016 | [64] | NCU | 850 | 22.4 | 40 | 25 | 4 | 2013 | [65] | NCU | 850 | 26 | 41 | 25 | 8 | 2015 | [66] | UCSB | 980 | >20 | 35 | 20 | 3 | 2007 | [67] | TU Berlin | 980 | | 44 | 25 | 6 | 2011 | [40] | TU Berlin | 980 | 24.7 | 50 | 25 | 5 | 2014 | [68] | TU Berlin | 980 | 26.6 | 52 | 25 | 6 | 2016 | [39] | TU Berlin | 980 | 35.5 | | 25 | 3 | 2018 | [69] | CUT | 1060 | 22 | 50 | 25 | 4 | 2017 | [70] | NEC | 1100 | 20 | 25 | 25 | 6.9 | 2006 | [53] | NEC | 1100 | 24 | 30 | 25 | 6 | 2007 | [71] | NEC | 1100 | 24 | 40 | 25 | 6 | 2008 | [72] |
|
Table 1. Modulation Bandwidths and Bit Rates of VCSELs at Room Temperature Using the Standard On–Off Keying in a Back-to-Back Data Transmission Configuration
Group | (nm) | Bandwidth (GHz) | Bit Rate (Gbps) | Temperature (°C) | Oxide Aperture (μm) | Year | Refs. | Finisar | 850 | 10 | 14 | 95 | 8 | 2012 | [91] | Emcore | 850 | 16 | 28 | 85 | 7.5 | 2013 | [92] | CUT | 850 | 21 | 40 | 85 | 7 | 2013 | [93] | IBM-CUTa | 850 | 21 | 50 | 90 | 6 | 2015 | [94] | UIUC | 850 | 24.5 | 50 | 85 | 5 | 2016 | [64] | NCU | 850 | 22.4 | 34 | 85 | 4 | 2013 | [65] | NCU | 850 | 20 | 41 | 85 | 8 | 2015 | [66] | VIS | 850 | | 25 | 150 | 4 | 2018 | [95] | VIS | 850 | | 25 | 130 | 4 | 2018 | [95] | TU Berlin | 980 | 11 | 20 | 120 | 3 | 2008 | [97] | TU Berlin | 980 | | 38 | 85 | 6 | 2011 | [40] | TU Berlin | 980 | | 30 | 120 | 6 | 2011 | [40] | TU Berlin | 980 | 23 | 46 | 85 | 5 | 2014 | [68] | TU Berlin | 980 | | 38 | 85 | 5.5 | 2014 | [98] | TU Berlin | 980 | 18 | 35 | 85 | 3 | 2014 | [99] | TU Berlin | 980 | 24.5 | 50 | 85 | 6 | 2016 | [39] | CUT | 1060 | 16 | 40 | 85 | 4 | 2017 | [70] |
|
Table 2. Selected Results on Bandwidths and Bit Rates of VCSELs at High Temperatures in an On–Off Keying Modulation Format for Back-to-Back Data Transmission Configuration
Group | (nm) | Bit Rate (Gbps) | Temperature (°C) | Energy eff. (fJ/bit) | Oxide Aperture (μm) | Year | Refs. | TU Berlin-VIS | 850 | 25 | 25 | 99 | 2 | 2011 | [96] | TU Berlin-VIS | 850 | 17 | 25 | 69 | 2 | 2011 | [96] | TU Berlin-VIS | 850 | 25 | 25 | 56 | 3.5 | 2012 | [101] | TU Berlin | 850 | 40 | 25 | 108 | 4 | 2013 | [104] | CUT | 850 | 50 | 25 | 95 | 3.5 | 2015 | [60] | CUT | 850 | 40 | 25 | 73 | 3.5 | 2015 | [60] | UIUC | 850 | 40 | 20 | 395 | 4 | 2014 | [63] | NCU | 850 | 12.5 | 25 | 109 | 6 | 2011 | [105] | NCU | 850 | 34 | 25 | 345 | 6 | 2011 | [105] | NCU | 850 | 34 | 25 | 107 | 4 | 2013 | [65] | UCSB | 980 | 35 | 20 | 286 | 3 | 2009 | [67] | TU Berlin | 980 | 38 | 85 | 177 | 5.5 | 2014 | [98] | TU Berlin | 980 | 35 | 85 | 139 | 3 | 2014 | [99] | TU Berlin | 980 | 35 | 25 | 145 | 3 | 2015 | [106] | Furukawa | 1060 | 10 | 25 | 140 | | 2011 | [107] | Furukawa | 1060 | 25 | 25 | 76 | | 2014 | [108] | CUT | 1060 | 50 | 25 | 100 | 4 | 2017 | [70] |
|
Table 3. Energy Efficiencies of High-Speed VCSELs with the On–Off Keying Modulation Format in a Back-to-Back Data Transmission Configuration