[1] Gong Yuguang, Li Wei, Cai Haihong et al.. Simulation of microbolometers based on α-Si: H thin films with thermal and mechanical performance [J]. Chinese J.Sensors and Actuators, 2009, 22(8): 1122~1126
[2] Wang Tao, Jiang Yadong, Chen Chao et al.. Preparation method of a kind of uncooled IRFPAs [P]. China Patent, CN 101357747A
[3] Hideo Wada, Mitsuhiro Nagashima. Fabrication process for 256×256 bolometer-type uncooled infrared detector[C]. SPIE, 1997, 3224: 40~51
[4] Yang Xiaoyu, Jiang Yadong, Wu Zhiming et al.. The optimized design of microbolometer [J]. Chinese J. Electron. Devices, 2007, 30(4): 1171~1174
[5] Li Su, Wu Zhiming, Jiang Yadong et al.. Performance analysis of microbolometer microbridge structure [J]. Chinese J. Sensors and Actuators, 2006, 19(5): 1728~1730
[6] Stephen D. Senturia. Microsystem Design[M]. Liu Zewen et al. Transl.. Beijing: Publishing House of Electronics Industry, 2004. 136~137
[7] Qian Jin, Liu Cheng, Zhang Dacheng et al.. Residual stress in micro-electro-mechanical systems [J]. J. Mechanical Strength, 2001, 23(4): 393~401
[9] Motohisa Taguchi, Kaoru Kawata, Tsukasa Matsuura et al.. Deformation control of metal/nitride microbridges [J]. IEICE Trans. Electron., 80(2): 221~225
[11] C. H. Hsueh. Thermal stress in elastic multilayer systems [J]. Thin Solid Films, 2002, 418(2): 182~188
[12] G. H. Olsen, M. Ettenberg. Calculated stress in multilayered heteroepitaxial structures [J]. J. Appl. Phys., 1977, 48(6): 2543~2547
[13] Jun-Hyub Park, Hyeon-Chang Choi. FEM analysis of multilayered MEMS device under thermal and residual stress [J]. Microsystem Technologies, 2005, 11(8-10): 925~932
[15] Liu Xiangxin, Meng Xianyi. Basis and Application of ANSYS [M]. Beijing: Science Press, 2006. 470~476
[16] Tai-ran Hsu. MEMS & Microsystems Design and Manufacture [M].Wang Xiaohao et al. Transl.. Beijing: China Machine Press, 2004. 225
[17] Li Biao. Design and simulation of an uncooled double-cantilever microbolometer with the potential for ~mK NETD [J]. Sensors and Actuators, A: Physical, 2004, 112(2-3): 351~359