In the micro-fabrication process of microbridges of uncooled infrared focal plane arrays (IRFPA), the microbridges are deformed by the thermal stress in thin films due to the acute temperature changes. Such deformation is harmful to the devices. The deformation of the microbridges is analyzed and two ways to control the deformation are presented: 1) choosing a better electrode material which has a lower thermal expansion coefficient and smaller Young modulus; 2) adding another SiNx thin film on the surface of electrode. Results indicate that by using above two ways, the deformation can be efficiently reduced from 1.4740 μm to 0.4799 μm and 0.0704 μm respectively, the aim of controlling the deformation is achieved.