• Microelectronics
  • Vol. 51, Issue 4, 557 (2021)
GAO Hengbin1, SUN Yabin1, HU Shaojian2, SHANG Enming2, LIU Yun1, LI Xiaojin1, and SHI Yanling1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.13911/j.cnki.1004-3365.200530 Cite this Article
    GAO Hengbin, SUN Yabin, HU Shaojian, SHANG Enming, LIU Yun, LI Xiaojin, SHI Yanling. 3 nm GAAFET RF Small Signal Equivalent Circuit Model[J]. Microelectronics, 2021, 51(4): 557 Copy Citation Text show less

    Abstract

    A new type of RF small-signal equivalent circuit model and an analytical modeling method based on rational function fitting were proposed for 3 nm gate-all-around device. At first, the bias-independent extrinsic gate, source and drain resistance, gate-to-source/gate-to-drain capacitance, and substrate capacitance and resistance were extracted. Then, the bias-dependent intrinsic parasitic parameters were extracted under different bias of the device. The 3D TCAD and Matlab were used to simulate the device and get parasitic parameters by fitting, and the parameter results were put in ADS for verification. The results showed that the maximum error of S parameter between TCAD simulation and equivalent circuit simulation was less than 269% at 10 MHz~300 GHz frequency range. The accuracy of the established model and modeling method were verified. The research results had a reference value for RF IC design.
    GAO Hengbin, SUN Yabin, HU Shaojian, SHANG Enming, LIU Yun, LI Xiaojin, SHI Yanling. 3 nm GAAFET RF Small Signal Equivalent Circuit Model[J]. Microelectronics, 2021, 51(4): 557
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