Fig. 1. (a) Thermo-optical (TO) modulator based on Ge-on-SOI waveguide platform
[6]; (b) Si-on-sapphire TO modulator with PhC (photonic crystal) waveguide
[7]; (c) TO modulator based on SOI with spiral waveguides arms. Inset shows the heater
[8]; (d) 2×2 MZI TO switch
[10]and; (e) Dual mode TO switch based on SOI MZI structure at 2 μm band
[11] Fig. 2. Thermo-optic modulator with doped-silicon heater
[12]. (a) Microscope image, (b) the static response and (c) the dynamic response of the MZI modulator; (d) Microscope image, (e) the static response and (f) the dynamic response of the MRR-based modulator
Fig. 3. (a) Diagrams of silicon photonic circuits integrated with LiNbO
3 thin plate, wafer, single die and basic circuit and the cross-section illustration of bonding
[16]; (b) Integrated Ta
2O
5 -LiNbO
3 rib waveguide
[17]; (c) Mid-infrared electro-optic modulator based on Si-on-LiNbO
3 waveguide
[18] Fig. 4. Changes of (a) refractive index and (b) absorption coefficient of silicon and germanium in the Mid--IR caused by free carrier; (c) Wavelength scaling of −Δ
n/Δ
k[23], the carrier concentration is fixed at 5×10
17 cm
−3 Fig. 5. (a), (b) carrier-injection modulators
[24,26] and (c) carrier-depletion modulators based on SOI
[27]; (d) Electro-optic modulator and electro-absorption modulator on Ge-on-Si
[28] Fig. 6. Graphene-chalcogenide modulator
[4]. (a) The structure and working principle of the graphene Mid-IR waveguide modulator; (b) Measured and (c) simulated modulation depth of the device versus wavelength and bias (Unit: dB/mm)
Fig. 7. Performance of Mid-IR graphene-chalcogenide modulators
[38]. (a) The Fermi-level-related optical absorption of a graphene layer across the Mid-IR band evaluated by the surface conductive model; (b) Simulation result of modulation depth for graphene mid-IR electro-absorption modulators (The white dashed line is zero modulation depth); (c) FOM (modulation depth/insertion loss) of the modulator (The black dashed line represents unity FOM)
Fig. 8. Mid-IR extrinsic silicon photodetectors. (a) B doped SOI detector; (b) SEM of the same device (Inset: Schematic diagram of a silicon waveguide); (c) Relationship between the reverse bias voltage and the photocurrent/response of the detectorat two micron wavelength range; (d) Eye diagram of the detector with voltage of 27 V
[56, 69] Fig. 9. Mid-infrared Black Phosphorus(BP) detector. (a)-(b) Structure of the silicon-based BP slow-light integrated detector; (c) Relationship between the power and the responsivity of the BP detector at three different wavelengths; (d) Current noise power density of the photonic crystal waveguide and the subwavelength grating waveguide BP photodetectors, respectively
[52] Type | Active material | Wavelength/
μm
| Responsivity/
A·W−1 | 3 dB bandwidth/
Hz
| Room temperature NEP/
pW·Hz−1/2a | Reference | a在光电导器件或零偏下光电二极管,基本的噪声源是约翰逊噪声,通过器件的电阻进行计算。在施加偏置的光电二极管中,噪声通常由散粒噪声主导,通过暗电流计算表征。
b在计算石墨烯器件中的散粒噪声时,假定Fano因子为1/3。
c在离子掺杂的硅探测器中,由于器件之间存在较大的性能偏差(尤其是暗电流),提到的指标(响应度、带宽和NEP)通常是不同器件测试的结果,所以表中列出的是每个指标的最佳值。
| Heterogeneous integrated semiconductors | GaInAsSb on GaSb | 2.3 | 1.4 | N/A | 0.54 | [44-46]
| | MQW on InP | 2.35 | 1.6 | N/A | 0.035 | [47-48]
| | InAsSb on GaSb | 3.8 | 0.3 | N/A | 56 | [49]
| Monolithically integrated semiconductors | PbTe | 2.1-2.5 | 1.0 | N/A | 0.69 | [50]
| 2-D Van der Waals materials | Graphene/Si juncton | 2.75 | 0.13 | N/A | 0.36 b | [51]
| | Graphene | 2.05 | 0.25 | N/A | 99 | [4]
| | Black phosphorus | 3.8 | 11.31 | 0.55 K | 12 | [52]
| Ion-implanted silicon | Si+ implated Si
| 2.2-2.3 | 0.01 | 1.7 G | 12.7 c | [53]
| | Zn+implanted Si
| 2.2-2.4 | 0.09 | 1.7 G | 11.2 | [54]
| | Ar+ implanted Si
| 2.2-2.3 | 0.021 | N/A | 2.2 | [55]
| | B+ implanted Si
| 1.96-2.5 | 0.3 | 15 | 165 | [56]
| | S+implated Si
| 3.36-3.74 | 0.002 2 | N/A | 1000 | [57]
|
|
Table 1. Hybrid integrated photodetectors with different active materials on silicon