• Infrared and Laser Engineering
  • Vol. 50, Issue 5, 20200397 (2021)
Youdao Gao1, Fudong Li1, Zhengxiang Shen2, Lin Ding1, Bin Hu1, and Shaowei Xu1
Author Affiliations
  • 1Beijing Institute of Space Mechanics & Electricity, Beijing 100094, China
  • 2School of Physical Science and Engineering, Tongji University, Shanghai 200092, China
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    DOI: 10.3788/IRLA20200397 Cite this Article
    Youdao Gao, Fudong Li, Zhengxiang Shen, Lin Ding, Bin Hu, Shaowei Xu. Simulation method and its test verification of cryogenic infrared lens design[J]. Infrared and Laser Engineering, 2021, 50(5): 20200397 Copy Citation Text show less

    Abstract

    At low temperature, the lens structure will produce thermal deformation, which will affect the modulation transfer function (MTF) and defocus of the lens, thus affecting the quality of optical imaging. Based on an infrared remote sensor, a set of transmission cryogenic lens with thermal unloading function was designed for the 210 K low-temperature working environment. The finite element model was established, and the thermal deformation data was obtained by loading the simulation of the in-orbit working environment temperature field. Finally, the variation of lens MTF and defocusing amount were calculated, and the structure of cryogenic lens was optimized through this simulation analysis method. After the installation and adjustment of the cryogenic lens, the cryogenic lens and other test equipment were placed in a vacuum tank, and MTF and the best focal plane position of the lens were tested and calibrated under ambient temperature and low temperature conditions. The test results show that the errors are within the acceptable range, the MTF variation is only 0.2%, indicating that the cryogenic lens multi-field coupling simulation method is reliable and can guide the design of cryogenic lens for infrared remote sensor.
    Youdao Gao, Fudong Li, Zhengxiang Shen, Lin Ding, Bin Hu, Shaowei Xu. Simulation method and its test verification of cryogenic infrared lens design[J]. Infrared and Laser Engineering, 2021, 50(5): 20200397
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