[1] Amy R A, Aglietti G S, Richardson G. Board-level vibration failure criteria for printed circuit assemblies: an experimental approach [J]. IEEE Transactions on Electronics Packaging Manufacturing, 2010, 33(4): 303-311.
[2] Chan Y C, Yeung F, Mok T S. Failure analysis of miniaturized multilayer ceramic capacitors in surface mount printed circuit board assemblies [J]. Journal of Materials Science: Materials in Electronics, 1994, 5: 25-29.
[3] Vogel G. Avoiding flex cracks in ceramic capacitors: Analytical tool for a reliable failure analysis and guideline for positioning cercaps on PCBs [J]. Microelectronics Reliability, 2015, 55(9-10): 2159-2164.
[4] Wunderle B, Braun T, May D, et al. Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading. [J]. Journal of Electronic Packaging, 2009, 131(1): 011012.
[5] Lv Weimin, Hu Dong, Xie Jinsong, Case study on prognostics technique based on PoF to predict life of PCB [J]. Journal of University of Electronic Science and Technology of China, 2013, 42(2): 635-640. (in Chinese)
[6] Liu Zhimin. Reliability evaluation of FPC under bending stress [C]//Proceedings of 2011 International Conference on Electronic & Mechanical Engineering and Information Technology, 2011, 6: 2955-2958.
[7] Medvedev A M. A metalized-hole PCB as a strain gauge [J]. Instruments and Experimental Techniques, 2016, 59(6): 879-881.
[8] Shi Hongbin, Ikezawa Satoshi, Ueda Toshitsugu. A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring [C]//Sensors, 2011 IEEE, 2011: 1697-1700.
[9] Huang Chienyi, Ying Kuoching. Applying strain gauges to measuring thermal warpage of printed circuit boards [J]. Measurement, 2017, 110: 239-248.
[10] Shi Hongbin, Wu Jinchang, Zhang Jing. Selection methodology study of strain gages for printed circuit board strain measurement [J]. Printed Circuit Information, 2009(9): 30-35. (in Chinese)
[11] Wang Yonghong, Dan Xizuo, Li Junrui, et al. Multi-perspective digital image correlation method using a single color camera [J]. Science China Technological Sciences, 2017, 60: 1-7.
[12] Chen Xu, Yang Lianxiang, Xu Nan, et al. Cluster approach based multi-camera digital image correlation: Methodology and its application in large area high temperature measurement [J]. Optics and Laser Technology, 2014, 57: 318-326.
[13] Xue Yuan, Su Yong, Zhang Chi, et al. Full-field wrist pulse signal acquisition and analysis by 3D Digital Image Correlation [J]. Optics and Lasers in Engineering, 2017, 98: 76-82.
[14] Pan B, Wang B, Lubineau G, et al. Comparison of subset-based local and finite element-based global digital image correlation [J]. Experimental Mechanics, 2015, 55(5): 887-901.
[15] Pan Bin, Wang Bo. Research progress in digital volume correlation method [J]. Chinese Science Bulletin, 2017, 62(16): 1671-1681. (in Chinese)
[16] Dai Xianglu, Xie Huimin, Wang Huaixi. Analysis of the error caused by off-plane displacement in two-dimensional digital image correlation measurement [J]. Journal of Experimental Mechanics, 2013, 28(1): 10-19. (in Chinese)
[17] Shao Xinxing, Chen Zhenning, Dai Yuntong, et al. Research progress of several key problems in digital image correlation method [J]. Journal of Experimental Mechanics, 2017, 32(2): 305-325. (in Chinese)
