A method of full-field micro strain measurement using digital image correlation was proposed to evaluate the risk of printed circuit board assembly failure induced by stress. It outperformed traditional testing methods based on experiment in terms of full-field strain measurement and location of strain concentration. Experimental method based on three-dimensional digital image correlation and stress loading strategy was designed. The risk of circuit board assembly failure was evaluated by the obtained full-field distributions of principle strain and history curves of strain on selected local areas. High repeatability of the presented method, which was better than 100 με, was exhibited by the experiments, allowing the obtainment of the circuit board assembly full-field micro strain distribution. Moreover, areas where strain exceeds rated value can be localized easily and exhibited intuitively. The presented method provides important measured data which can be used to improve the circuit board assembly design, reduce the risk of circuit board assembly failure, and protect the safety of electronic components.