• Infrared and Laser Engineering
  • Vol. 51, Issue 3, 20220087 (2022)
Xi Wang1, Yingjie Liu1, Zimeng Zhang1, Jianing Wang1, Yong Yao1, Qinghai Song2, and Ke Xu1、*
Author Affiliations
  • 1Department of Electronic & Information Engineering, Harbin Institute of Technology, Shenzhen 518055, China
  • 2Department of Science, Harbin Institute of Technology, Shenzhen 518055, China
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    DOI: 10.3788/IRLA20220087 Cite this Article
    Xi Wang, Yingjie Liu, Zimeng Zhang, Jianing Wang, Yong Yao, Qinghai Song, Ke Xu. Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)[J]. Infrared and Laser Engineering, 2022, 51(3): 20220087 Copy Citation Text show less

    Abstract

    Driven by the development in big data services, the conventional optical fiber communication window was shifting from C-band to C+L band to meet the continuously increasing demand for bandwidths. Exploiting new wavebands became a crucial problem within the optical communications community. The 2 μm spectral range between near-infrared and mid-infrared held advantages of low transmission loss and broad gain bandwidth, which made it a promising candidate for the next window of free space laser and optical fiber communications. Even though the commercialization of the 2 μm optoelectronic devices was at early stage, recorded single-lane 100 Gbit/s transmission had been achieved in the laboratory. In the meantime, developing functional elements in this wavelength range was attracting extensive interests. In this paper, the recent advances of 2 μm silicon photonic device were introduced. Photonic integrated components on other platforms like III-V, thin-film lithium niobate, silicon nitride, and chalcogenide glass were also discussed. Finally, the 2 μm was envisioned on-chip photonic integrated devices.
    Xi Wang, Yingjie Liu, Zimeng Zhang, Jianing Wang, Yong Yao, Qinghai Song, Ke Xu. Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)[J]. Infrared and Laser Engineering, 2022, 51(3): 20220087
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