Processing technique | Feature size | Speed | Applicable metals | Characteristics | Laser-induced forward transfer (LIFT)[29-40] | Several μm | several tens of
micrometers per second
| Ag, Au,Al, Cu,Cr,Ge,Ni,Pd,
Pt,Sn,Ti,V,W,Zn, etc.
| Rapid manufacture of microstructures
with a precision down to submicron scale;
High surface roughness.
| Laser decal transfer (LDT)[41-45] | Depended on
the voxel size
| Depended on the
voxel size
| Ag, Au,Al, Cu,Cr,Ge,Ni,Pd,Pt,
Sn, Ti,V,W,Zn, etc.
| Rapid manufacture of voxels
with specific shapes.
| Femtosecond laser-induced photoreduction (FLIP)[46-57] | 100 nm-3 μm | several tens of
micrometers per second
| Ag,Au,Cu,Ni | Direct fabrication of sub-micron metal
structures; High surface roughness.
| Laser micro-sintering (LMS)[58-69] | >10 μm | several tens of
centimeters per second
| Al,Ag,Cu,Ni,T,
W,Mo,Cr
| High density of metal microstructures;
High surface roughness.
| 3D metalization of two-photon polymerization[70-80] | 120 nm
| several tens of
centimeters per second
| Ag, Au, Cu, etc. | Surface metallization for 3D structures. | Laser-assisted electrophoretic deposition (LAED)[81-85] | 500 nm-several μm | several hundreds of
nanometers per second
| Au | Direct fabrication of metal microstructures;
High surface roughness.
| Glass-channel molding assisted 3D printing[105] | 10-200 μm | − | Ag,Cu,Au,
Ni,Pd, etc.
| Low surface roughness;
Widely tunable feature size.
|
|