• Journal of Terahertz Science and Electronic Information Technology
  • Vol. 20, Issue 4, 385 (2022)
LI Longqian*, FANG Hua, FENG Jiao, and LI Peng
Author Affiliations
  • [in Chinese]
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    DOI: 10.11805/tkyda2020281 Cite this Article
    LI Longqian, FANG Hua, FENG Jiao, LI Peng. Design and implementation of PCIe interface logic based on FPGA[J]. Journal of Terahertz Science and Electronic Information Technology , 2022, 20(4): 385 Copy Citation Text show less
    References

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    [3] ROTA L,CASELLE M,CHILINGARYAN S,et al. A PCIe DMA architecture for multi-gigabyte per second data transmission[J].IEEE Transactions on Nuclear Science, 2015,62(3):972-976.

    [5] JIANG H X,LI S L,LI H Y,et al. A high-performance and hardware-efficient PCIe transmission for a multi-channel video using command caching and dynamic splicing on FPGA[J]. Journal of Circuits,Systems and Computers, 2018,27(4):1-19.

    [8] KAVIANIPOUR H, MUSCHTER S, BOHM C, et al. High performance FPGA-based DMA interface for PCIe[J]. IEEE Transactions on Nuclear Science, 2014,61(2):1-3.

    [13] ZHAO Y X,LIU X,YANG J. A resource and timing optimized PCIe DMA architecture using FPGA internal data buffer[J]. IEICE Electronics Express, 2019,16(1):1-12.

    [16] MBAKOYIANNIS D, TOMOUTZOGLOU O, KORNAROS G. Energy-performance considerations for data offloading to FPGAbased accelerators over PCIe[J]. ACM Transactions on Architecture and Code Optimization, 2018,15(1):1-24.

    [17] SHIM C, SHINDE R, CHOI M. Compatibility enhancement and performance measurement for socket interface with PCIe interconnections[J]. Human-centric Computing and Information Sciences, 2019,9(10):1-18.

    [18] PCI-SIG. PCI express 2.0 base specification revision 0.9[S/OL]. [2020-07-16]. Peripheral Component Interconnect Special Interest Group(PCI-SIG), 2006. http://www.pcisig.com/specications/pciexpress/base2/.

    LI Longqian, FANG Hua, FENG Jiao, LI Peng. Design and implementation of PCIe interface logic based on FPGA[J]. Journal of Terahertz Science and Electronic Information Technology , 2022, 20(4): 385
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