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    Journals >Optoelectronic Technology >Volume 44 >Issue 1 >Page 34 > Article
    • Optoelectronic Technology
    • Vol. 44, Issue 1, 34 (2024)
    Research on Numerical Simulation of Glue Filling Process
    Xumeng QIU1,2, Yunchang CHEN1,2, Sai ZHENG1,2, Junwei TIAN1,2, and Weixian ZHAO1,2
    Author Affiliations
  • 1The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 2006, CHN
  • 2National Flat Panel Display Engineering Technology Research Center, Nanjing 10016, CHN
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    DOI: 10.12450/j.gdzjs.202401007 Cite this Article
    Xumeng QIU, Yunchang CHEN, Sai ZHENG, Junwei TIAN, Weixian ZHAO. Research on Numerical Simulation of Glue Filling Process[J]. Optoelectronic Technology, 2024, 44(1): 34 Copy Citation Text show less
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    Xumeng QIU, Yunchang CHEN, Sai ZHENG, Junwei TIAN, Weixian ZHAO. Research on Numerical Simulation of Glue Filling Process[J]. Optoelectronic Technology, 2024, 44(1): 34
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