• Optoelectronic Technology
  • Vol. 44, Issue 1, 34 (2024)
Xumeng QIU1,2, Yunchang CHEN1,2, Sai ZHENG1,2, Junwei TIAN1,2, and Weixian ZHAO1,2
Author Affiliations
  • 1The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 2006, CHN
  • 2National Flat Panel Display Engineering Technology Research Center, Nanjing 10016, CHN
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    DOI: 10.12450/j.gdzjs.202401007 Cite this Article
    Xumeng QIU, Yunchang CHEN, Sai ZHENG, Junwei TIAN, Weixian ZHAO. Research on Numerical Simulation of Glue Filling Process[J]. Optoelectronic Technology, 2024, 44(1): 34 Copy Citation Text show less
    Glue filling process
    Fig. 1. Glue filling process
    Viscosity curve changing with reaction time
    Fig. 2. Viscosity curve changing with reaction time
    Inlet and outlet of glue filling process
    Fig. 3. Inlet and outlet of glue filling process
    Mesh of glue filling process
    Fig. 4. Mesh of glue filling process
    The results of simulation
    Fig. 5. The results of simulation
    Photos of actual results of glue filling process
    Fig. 6. Photos of actual results of glue filling process
    Schematic of laminated LCD
    Fig. 7. Schematic of laminated LCD
    参数单位数值
    密度kg/m31 020
    粘度Pa·s400
    灌胶速度kg/s0.000 3
    灌胶空腔尺寸mm×mm×mm215×160×1
    排气口尺寸mm×mm4×1
    Table 1. Processing parameters