• Optoelectronic Technology
  • Vol. 44, Issue 1, 34 (2024)
Xumeng QIU1,2, Yunchang CHEN1,2, Sai ZHENG1,2, Junwei TIAN1,2, and Weixian ZHAO1,2
Author Affiliations
  • 1The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 2006, CHN
  • 2National Flat Panel Display Engineering Technology Research Center, Nanjing 10016, CHN
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    DOI: 10.12450/j.gdzjs.202401007 Cite this Article
    Xumeng QIU, Yunchang CHEN, Sai ZHENG, Junwei TIAN, Weixian ZHAO. Research on Numerical Simulation of Glue Filling Process[J]. Optoelectronic Technology, 2024, 44(1): 34 Copy Citation Text show less

    Abstract

    The glue filling process has been widely used in oversize optical-bonding, but the lack of theoretical research on its process parameters makes the verification more complicated. In this paper, under the premise of reasonable assumptions, a theoretical calculation model was proposed based on the basic equations of fluid dynamics, and it was simulated by numerical analysis software. Finally, the optimal parameters of the process were obtained. The results showed that the designed theoretical calculation model was basically consistent with the actual flow pattern, and the glue filling time had an error of 10 s, which could meet the actual and practical accuracy requirements. The model could be used to explore the variation law of the glue filling process parameters, so as to quickly determine the best solution to process parameters.