[1] G Moschetti, N Wadefalk, P A Nilsson. Solid State Electron, 64, 47(2011).
[2] A Haddadi, R Chevallier, A Dehzangi. Appl. Phys. Lett, 110, 101(2017).
[3] H Guan, H L Lv, H Guo, Y M Zhang. J. Appl. Phys, 118(2015).
[4] M Malmkvist, E Lefebvre, M Borg, L Desplanque, X Wallart, G Dambrine. IEEE Trans. Microwave Theory & Tech, 56, 2685(2018).
[5] H Guan, H Guo. Chin. Phys. B, 26(2017).
[6] G Moschetti, N Wadefalk, P A Nilsson. IEEE Microwave & Wireless Compon. Lett, 22, 144(2012).
[7] X R Cui, H L Lv. J. Infrared & Millimeter Waves, 37, 385(2018).
[8] T Hashizume, S Ootomo, T Inagaki. J. Vac. Sci. Technol. B, 21, 1828(2003).
[9] H Guan, H L Lv. Thin Solid Film, 661, 137(2018).
[10] L F Wu, Y M Zhang, H L Lv. Jpn. J. Appl. Phys, 54(2015).
[11] L N Liu, H W Choi, J P Xu, W M Tang. IEEE Trans. Electron Dev, 65, 72(2007).
[12] C J Jin, H L Lv, Y M Zhang, H Guan. Thin Solid Films, 619, 48(2016).
[13] V Mikhelashvili, B Meyler, J Shneider. Microelectron. Reliab, 45, 933(2005).
[14] J Gao, G He, M Liu. J. Alloys Compd, 691, 504(2017).
[15] C J Jin, H L Lv, Y M Zhang, H Guan. Solid-State Electron, 123, 106(2016).
[16] Y C Lin, H D Trinh, T W Chuang. IEEE Electron Dev. Lett, 34, 1229(2013).
[17] H Trinh, Y Lin, H Wang, C Chang, K Kakushima, H Iwai. Appl. Phys. Express, 5, 1104(2012).
[18] H Altuntas, I Donmez, C Ozgit-Akgun, N Biyikli. J. Vac. Sci. Technol. A, 32(2014).
[19] C Liu, Y M Zhang, Y M Zhang, H L Lv. J. Appl. Phys, 116(2014).
[20] N A Maleev, M A Bobrov, A G Kuzmenkov, A P Vasil’Ev, M M Kulagina. Tech. Phys. Lett, 44, 862(2018).
[21] M Asif, C Chen, D Peng, W Xi, J Zhi. Solid State Electron, 142, 36(2018).
[22] H Guan, C Y Jing. Coating, 8, 417(2018).
[23] B Brennan, R V Galatage, K Thomas. J. Appl. Phys, 114, 317(2013).
[24] D Inci, O Cagla, B Necmi. J. Vac. Sci. Technol. A, 31(2013).
[25] H Guan, H L Lv, H Guo, Y M Zhang, Y M Zhang, L F Wu. Chin. Phys. B, 24(2015).
[26] L M Terman. Solid State Electron, 5, 285(1962).