Jianxin Du, Jiaqing Zhao, Haitao Wang, Libin Sun, Xinxin Wu. Envelope Element Local Digital Image Correlation Method for Crack Tip Deformation Field Measurement[J]. Acta Optica Sinica, 2022, 42(1): 0112003
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- Acta Optica Sinica
- Vol. 42, Issue 1, 0112003 (2022)
Fig. 1. Mesh division in ROI
Fig. 2. Calculation for three types of methods. (a) Mesh without crack; (b) mesh of crack face; (c) mesh of crack tip
Fig. 3. Schematic diagrams of three kinds of smoothing calculation points. (a) Points far from crack; (b) points near crack face; (c) points near crack tip
Fig. 4. Simulated images with crack. (a) Reference image; (b) deformed image
Fig. 5. RMSE of displacement field U and strain field Ux versus element/subset size. (a) Displacement field U; (b) strain field Ux
Fig. 6. Comparison between theoretical solution curve and optimum solution curves of strain Ux obtained by different methods on lines. (a) Line 1; (b) line 2
Fig. 7. Relationship between RMSE of strain field Ux and Gaussian noise level for three methods
Fig. 8. Reference image and deformed image. (a) Reference image; (b) deformed image
Fig. 9. Track tips under an optical microscope. (a) 100×; (b) 200×
Fig. 10. Displacement field U and strain field Ux calculated by HELDIC method. (a) Displacement field U; (b) strain field Ux
Fig. 11. Comparison of strain field Ux at lines 1 and 2 obtained by three different methods
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Table 1. Element/subset sizes used in three methods
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