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    Journals >Laser & Optoelectronics Progress >Volume 53 >Issue 12 >Page 122301 > Article
    • Laser & Optoelectronics Progress
    • Vol. 53, Issue 12, 122301 (2016)
    Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation
    Liu Chao1、*, Fu Renli1, Gu Xiguang1, Zhou Ming2, Tian Yang2, and Cai Junde1
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  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/lop53.122301 Cite this Article Set citation alerts
    Liu Chao, Fu Renli, Gu Xiguang, Zhou Ming, Tian Yang, Cai Junde. Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation[J]. Laser & Optoelectronics Progress, 2016, 53(12): 122301 Copy Citation Text show less
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    Liu Chao, Fu Renli, Gu Xiguang, Zhou Ming, Tian Yang, Cai Junde. Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation[J]. Laser & Optoelectronics Progress, 2016, 53(12): 122301
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