• Laser & Optoelectronics Progress
  • Vol. 59, Issue 17, 1714007 (2022)
Li Cheng, Chao Wu*, Yan Chen, and Zhengjun Xiong
Author Affiliations
  • Institute of Laser and Intelligent Manufacturing Technology, South-Central Minzu University, Wuhan 430074, Hubei , China
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    DOI: 10.3788/LOP202259.1714007 Cite this Article Set citation alerts
    Li Cheng, Chao Wu, Yan Chen, Zhengjun Xiong. Removal of Liquid Crystal Polymer Flexible Copper-Clad Laminates Using Ultraviolet Laser[J]. Laser & Optoelectronics Progress, 2022, 59(17): 1714007 Copy Citation Text show less
    Experimental material. (a) Micromorphology of LCP flexible copper-clad laminates; (b) size of LCP flexible copper-clad laminates; (c) molecular structure of PHB-PPI copolymer LCP
    Fig. 1. Experimental material. (a) Micromorphology of LCP flexible copper-clad laminates; (b) size of LCP flexible copper-clad laminates; (c) molecular structure of PHB-PPI copolymer LCP
    Schematic of the experimental setup of ultraviolet processing system
    Fig. 2. Schematic of the experimental setup of ultraviolet processing system
    Experimental results. (a) Schematic of heat-affected zone; (b) HAZ measurement chart of LCP under a confocal microscope
    Fig. 3. Experimental results. (a) Schematic of heat-affected zone; (b) HAZ measurement chart of LCP under a confocal microscope
    Removal depth versus average power
    Fig. 4. Removal depth versus average power
    HAZ width versus average power
    Fig. 5. HAZ width versus average power
    Experimental results. (a) Energy density distribution of a Gaussian beam; (b) effect of laser power on plasma zone
    Fig. 6. Experimental results. (a) Energy density distribution of a Gaussian beam; (b) effect of laser power on plasma zone
    Micromorphology of LCP substrate film removal obtained under different laser powers. (a) P=1.5 W; (b) P=2.7 W; (c) P=3.6 W
    Fig. 7. Micromorphology of LCP substrate film removal obtained under different laser powers. (a) P=1.5 W; (b) P=2.7 W; (c) P=3.6 W
    Removal depth versus scanning speed
    Fig. 8. Removal depth versus scanning speed
    HAZ width versus scanning speed
    Fig. 9. HAZ width versus scanning speed
    Effect of spot overlap rate on film removal. (a) v v>700 mm/s
    Fig. 10. Effect of spot overlap rate on film removal. (a) v<500 mm/s; (b) v>700 mm/s
    Micromorphology of the LCP substrate film removal obtained at different scanning speeds. (a) v =300 mm/s; (b) v =600 mm/s; (c) v =1000 mm/s
    Fig. 11. Micromorphology of the LCP substrate film removal obtained at different scanning speeds. (a) v =300 mm/s; (b) v =600 mm/s; (c) v =1000 mm/s
    Removal depth versus number of scanning layers
    Fig. 12. Removal depth versus number of scanning layers
    HAZ width versus number of scanning layers
    Fig. 13. HAZ width versus number of scanning layers
    Micromorphology of the LCP substrate film removal obtained with different number of layers. (a) Number of layers is 1; (b) number of layers is 4; (c) number of layers is 8
    Fig. 14. Micromorphology of the LCP substrate film removal obtained with different number of layers. (a) Number of layers is 1; (b) number of layers is 4; (c) number of layers is 8
    Test methodTechnical parameterValue
    Differential scanning calorimetryMelting point /°C330-350
    UL 94ZUFlammabilityVTM-0
    Legion method (50% relative humidity)Moistrue absorption /%0.03
    IEC62631-3-1/2Surface resistivity /Ω>5×1016
    IEC62631-3-1/2Volume resistivity /(Ω·cm)>2×1016
    Fabry-Perot methodDielectric dissipation factor0.002-0.003
    Thermomechanical analysisCoefficient thermal expansion /(10-6·°C-116
    Table 1. Physicochemical properties of experimental sample
    Technical parameterValue
    Wavelength /nm355
    Average power /W0-45
    Pulse energy /µJ0-62
    Pulse width /ns5
    Repetition frequency /kHz0-1000
    Table 2. Main technical parameters of laser
    Li Cheng, Chao Wu, Yan Chen, Zhengjun Xiong. Removal of Liquid Crystal Polymer Flexible Copper-Clad Laminates Using Ultraviolet Laser[J]. Laser & Optoelectronics Progress, 2022, 59(17): 1714007
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